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Home -News -Latest News -Filling the technological gap! China has developed a series of genomic chips for cattle

Filling the technological gap! China has developed a series of genomic chips for cattle

Release date:2025-07-23Author source:KinghelmViews:26

International Tech News:

1. According to reports, India is set to launch its first domestically developed semiconductor chip (using a 28nm process) in 2025, while six semiconductor fabrication plants are under construction.

2. Nikon has introduced the "DSP-100," a digital lithography system for semiconductor back-end processes, which is expected to be launched in 2026.

3. Germany’s Wacker has officially started operation of its new next-generation production line for manufacturing ultra-high purity polysilicon.

4. OpenAI CEO Sam Altman revealed that OpenAI is likely to bring “over one million GPUs” online by the end of this year.

5. Japan’s Kioxia has launched the LC9 series SSDs, featuring a solid-state drive with a storage capacity of 245.76TB—the largest storage device to date.

6. Japan’s Proterial has developed an electric vehicle motor magnet that requires no heavy rare earth metals, a breakthrough that could ease supply chain concerns stemming from China’s export restrictions on such materials.

 

Domestic Tech News:

1. Zhongke Semiconductor has launched four GaN ASIC intelligent fast-charging chips specifically designed for robotics scenarios: CT-3602, CT1020, CT1007, and CT-1901.

2. BaYi Space has built China’s first fully automated, flexible/mass production dual production line for hundred-ton-scale semiconductor KrF photoresist resin; upon reaching production capacity, the project is expected to generate revenue exceeding hundreds of millions of RMB.

3. Beijing Tongxin Technology's operations center has settled in Shenzhen Huaqiang Plaza. Guests including Zhou Shengming from Shenzhen Semiconductor Industry Association, Professor Wang Xin’an from Peking University, Zhu Ligui from Shandong Chamber of Commerce, Wu Bo from LCSC Electronics, and Song Shiqiang and He Junju from SLKOR (www.slkormicro.com) attended to jointly witness and wish for the rise of China’s domestic semiconductor industry!

4. A research team from Peking University and Renmin University has pioneered a “steaming basket” method, successfully achieving wafer-scale integration of high-quality indium selenide materials internationally.

5. Nexchip Semiconductor Corporation’s revenue in the first half of 2025 exceeded 5 billion RMB, with net profit potentially doubling.

6. The R&D team of the National Dairy Technology Innovation Center has successfully developed two genomic chips: one for genetic evaluation of bovine embryos used for breeding, and another functional genomic prediction chip targeting “high yield, disease resistance, and extended production cycles.”

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