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Home -News -Latest News -From 2025 to 2030, GMSL and LVDS will continue to dominate sensor links, while automotive Ethernet will lead the backbone network

From 2025 to 2030, GMSL and LVDS will continue to dominate sensor links, while automotive Ethernet will lead the backbone network

Release date:2025-06-06Author source:KinghelmViews:65

International Tech News:

1. The global robotics landscape is undergoing a major shift. The dominant advantage of the traditional "Big Four" industrial robot companies — ABB, Fanuc, Yaskawa, and KUKA — is fading, while new faces are emerging in collaborative robots and embodied intelligent robots.

2. From 2025 to 2030, GMSL and LVDS will continue to dominate sensor links, while automotive Ethernet will lead the backbone network.

3. Semiconductor foundry giant GlobalFoundries (GF) plans to invest $16 billion (approximately RMB 114.864 billion) to expand its semiconductor manufacturing and advanced packaging capabilities.

4. Global shipments of Bluetooth devices will surge from 5 billion units in 2023 to 7.5 billion units in 2028, with an expected compound annual growth rate (CAGR) of 8%.

5. On June 7, Kinghelm and Slkor will regularly hold training sessions: at 9:30 AM, Yang Bo, Deputy General Manager of Kinghelm (www.kinghelm.net), will deliver an exciting talk on “Connector Sales Skills and Strategies”; at 2:00 PM, Qiu Huilin, Director of Slkor’s Overseas Business Department, will conduct training titled “Leap from Mindset to Method.”

6. Microsoft has become a leader in driving the commercialization of artificial intelligence (AI) due to its $13.75 billion investment in OpenAI and its cloud infrastructure support.

 

Domestic Tech News:

1. A wafer-level advanced semiconductor packaging project with a total investment of 1.05 billion RMB has officially landed in Zhejiang.

2. In May, Chinese automakers intensified their efforts to enter the UK market, with their market share approaching 10%.

3. Jinglue Semiconductor has completed a multi-hundred-million RMB financing round, primarily aimed at supporting accelerated R&D and mass production of automotive connectivity and switching chips.

4. A 265 million RMB investment in the fourth-generation diamond semiconductor project has officially settled in the Ganquanbao Economic Development Zone, Urumqi.

5. The 2025 Matter China Developer Conference will be grandly held on June 13 at the Langham Hotel in Guangzhou.

6. BIWIN Storage has launched the TDP200 series industrial-grade M.2 PCIe SSDs specially designed for industrial big data transmission.

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Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

 

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