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  • Updated: 2024-12-23
  • Views: 4226
Samsung will hold a new product launch event in the United States on January 22 next year to officially release the Galaxy S25 series of new products, including models such as Galaxy S25, Galaxy S25+, and Galaxy S25 Ultra.
  • Updated: 2024-12-16
  • Views: 2416
Musk's xAI Offers Free Access to Grok-2 AI Chatbot
  • Updated: 2024-12-06
  • Views: 2456
AWS under Amazon will launch its first self-developed 3nm chip, which is expected to come out by the end of 2025.
  • Updated: 2024-11-25
  • Views: 3168
The "El Capitan" supercomputer, powered by AMD, leads the world in combining CPU and GPU computing, marking the sixth time it has topped the global Top500 supercomputer list.
  • Updated: 2024-11-22
  • Views: 3036
NVIDIA reported Q3 2024 revenue of $35.08 billion, a 94% year-over-year increase and a 17% quarter-over-quarter rise, surpassing analysts' expectations of $33.16 billion. Net income for the quarter reached $19.31 billion, up 109% year-over-year.
  • Updated: 2024-11-13
  • Views: 2825
South Korea plans to formulate the "Chip Act" to cope with the potential risks brought by the measures threatened by the incoming US President Donald Trump.
  • Updated: 2024-11-08
  • Views: 2153
Indavei has surpassed Apple to become the world’s most valuable company by market capitalization.
  • Updated: 2024-10-23
  • Views: 2846
Samsung is establishing advanced manufacturing facilities at its Hwaseong plant to enable mass production using a 2nm process. The company is also preparing to install equipment for a 1.4nm production line at its Pyeongtaek II plant.
  • Updated: 2024-10-18
  • Views: 2491
Samsung Electronics announced the successful development of its first 24Gb GDDR7 (seventh-generation Graphics Double Data Rate memory).
  • Updated: 2024-10-15
  • Views: 2449
The Japanese government is considering investing in the semiconductor foundry Rapidus, which aims to begin mass production of 2nm chips by 2027.
  • Updated: 2024-10-08
  • Views: 2403
3.SK Hynix has begun mass production of the world's first 12-layer HBM3E product, with a capacity of 36GB, which is the highest capacity currently available for……
  • Updated: 2024-09-29
  • Views: 3165
Infineon has successfully developed the world’s first 300mm gallium nitride (GaN) power semiconductor wafer technology.
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