International Tech News:

1. The Agency for Science, Technology and Research (A*STAR) in Singapore has announced the launch of a 200mm industrial-grade open R&D silicon carbide (SiC) production line.

2. The Bluetooth Special Interest Group (Bluetooth SIG) forecasts that global shipments of Bluetooth devices will exceed 5.3 billion units in 2025 and reach nearly 8 billion units by 2029.

3. In Q1 2025, the global smartphone market grew by 2% year-on-year, with Samsung maintaining its lead with a 20% market share.

4. Google has made several announcements in the field of AI foundation models, including Gemini 2.5 Pro, the diffusion language model Gemini Diffusion, the video generation model Veo 3 + Flow applications, and the image generation model Imagen 4.

5. The latest article in the "Dialogues with Song Shiqiang of Slkor" series, titled "Song Shiqiang’s Reflections on the Trial Use of AI Large Language Models in Text Writing", co-released by Kinghelm (www.kinghelm.net) and Slkor, has gone viral on major Chinese media platforms such as Eefocus, Changsha Information Base, Sichuan Focus News, Shenzhen News Network, and Toutiao, with total readership exceeding two million.

6. The influence of Bluetooth technology continues to expand, with increasing adoption across applications in smart devices, wireless audio, connected vehicles, and industrial IoT.

Domestic Tech News:

1. The main structure of the third-phase silicon carbide (SiC) production line in Zhuzhou has been successfully topped out as of May 2025. The project adopts 8-inch SiC wafers.

2. The Hongsheng Semiconductor project has completed 70% of its overall engineering progress. Once operational, it will have an annual production capacity of 5 billion semiconductor plastic packaging devices.

3. The 6th China MEMS Manufacturing Conference and Micro-Nano Manufacturing & Sensor Expo 2025 will be held from October 22 to 24 at the Suzhou International Expo Center.

4. HulinTong Industrial (Shanghai) Co., Ltd. has been established, with Wei Lingyun as its legal representative and a registered capital of USD 8 million (approximately RMB 57.7 million).

5. GigaDevice plans to issue overseas listed foreign shares (H-shares) and list them on the Main Board of the Hong Kong Stock Exchange.

6. The second phase of the standardized factory building project for third-generation and other advanced semiconductor industries is progressing at full speed and is expected to be completed by the end of July this year.

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