International Tech News:

1. Wolfspeed Launches New Topside-Cooling (TSC) SiC MOSFETs and Schottky Diodes to Optimize Thermal Management and Save Energy.
2. Bangladesh National Semiconductor Task Force Develops Roadmap to Unlock National Semiconductor Potential, Plans to Build Skilled Chip Design and Testing Workforce.
3. Corning Develops Specialized Glass Substrates for Semiconductors.
4. Samsung Electro-Mechanics Cancels Factory Plans in Mexico and Dissolves Local Subsidiary.
5. LG Electronics Sees Nearly 50% Drop in Q2 Profit Due to Rising Raw Material Costs and Product Prices.
6. Korea Reduces Dependence on Japanese Chip Materials, Lowers Photoresist Import Reliance from 93.2% to 65.4%.

Domestic Tech News:

1. William Li, Founder of NIO, Announces NX9031 Chip Will Be Open to the Entire Industry and Help Lower Costs.
2. Jingsheng Mechanical & Electrical Breaks Ground on 240,000-Piece Annual 8-Inch SiC Wafer Plant in Malaysia.
3. SLKOR (www.slkormicro.com) and Kinghelm(www.kinghelm.net) Jointly Held the "K Plan" Training Program, with Participants Sharing Insights Based on Practical Work Experience.
4. The 5th China IC Design Innovation Conference and IC Application Ecosystem Expo (ICDIA 2025) Will Be Held on July 11–12 at Suzhou Jinji Lake International Conference Center.
5. Shenzhen Releases IC Industry Policy and Launches RMB 5 Billion “Semi Industry Private Equity Fund” to Promote Full-Chain Breakthroughs.
6. HKUST and BYD Jointly Establish the “HKUST–BYD Embodied Intelligence Joint Lab,” Focusing on Robotics and Intelligent Manufacturing.

Mr. Song Shiqiang, General Manager of Kinghelm, introducing Lecturer Tang Shiping and the "K Plan"

Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.