International News:

1. Apple will unveil the latest iPad Pro in May, equipped with the Apple M4 chip.

2. The opening ceremony of the Sino-Korean Semiconductor Innovation (Kunshan) Base took place, with a planned total investment of $110 million, accelerating the development of a modern semiconductor specialty innovation park worth billions.

3. Tesla is set to collaborate with Baidu to deploy FSD (Full Self-Driving) autonomous driving services in the Chinese market using Baidu's lane-level navigation and maps.

4. French automaker Renault is in talks with NIO and Xiaomi to jointly expand electric vehicle and smart driving technology.

5. The "Semiconductor Investment Alliance Post-Investment Empowerment Conference" will be held from May 10th to 11th at the Nanjing Haizhou Integrated Microindustry Innovation Base.

6. Tokyo Seimitsu will construct a new factory in Aichi Prefecture to produce grinding machines for thinning semiconductor wafers. The estimated investment is around 10 billion yen (approximately $64.07 million), with construction expected to be completed around the summer of 2025.

7. MediaTek is expected to launch the new flagship mobile SoC chip, Dimensity 9400, in the second half of 2024.

8. Recently, Kinghelm Electronics (www.kinghelm.net) and Slkor Semiconductor have received high daily clicks for their chip news, sparking ongoing discussions.

China News:

1. The Ministry of Industry and Information Technology released the operating situation of the electronic information manufacturing industry in the first quarter of 2024, with a year-on-year increase in value-added of the electronic information manufacturing industry above a certain scale by 13% in the first quarter.

2. The "Implementation Plan for the Construction of Beijing's Computing Power Infrastructure (2024-2027)" mentions providing support to enterprises that purchase domestically controllable GPU chips for intelligent computing power services, based on a certain proportion of investment.

3. The Pan Quan team at Southern University of Science and Technology has made significant progress in the field of high-speed wired chip design and has published papers in the top-tier journal JSSC in the field of integrated circuit design.

4. The main steel structure of the R&D and industrialization project of advanced semiconductor process equipment by Tuojing Technology (Shanghai) has been fully completed, with a total planned investment of 930 million yuan.

5. The project of the headquarters of Kexin Microelectronics Chip Design has been officially signed, with a total investment of 900 million yuan, mainly for the construction of a power semiconductor product research and development center and a testing center.

6. The second phase of the R&D and industrialization project of semiconductor packaging and testing by Tongling Qiming Semiconductor is expected to be completed and put into production in early 2025.

7. The topping-out ceremony of the main factory building of Zhejiang Xingyao Semiconductor's 5G RF filter silicon wafer production line project, with an annual output of 120,000 pieces, has been successfully held, with a total investment of 750 million yuan.