International Tech News:

1. UK autonomous driving technology company Wayve is expanding into the Asian market with the establishment of a new testing and development center in Japan.

2. A team of 30 scientists from the Indian Institute of Science has submitted a proposal to the government to develop "angstrom-level" chips, which are significantly smaller than the smallest chips currently in production.

3. Samsung plans to discontinue production of several DDR4 memory products by the end of 2025, with the final order deadline set for early June.

4. Elon Musk is venturing into semiconductor packaging, with plans to build an in-house 700x700 mm packaging production line.

5. LG Electronics has announced its official exit from the electric vehicle (EV) charging station business.

6. Japanese semiconductor equipment supplier Tokyo Electron will establish a base in India to design its chip manufacturing tools and develop related software.

Domestic Tech News:

1. The International Symposium on Low-Temperature Bonding and 3D Integration Technology will open in Tianjin from August 3 to 4, 2025.

2. The recent surge in gold prices is affecting the semiconductor industry. Major OSAT (outsourced semiconductor assembly and test) providers Chipbond Technology and ChipMOS Technologies have announced price hikes, becoming the first in the sector to raise prices in response to the gold price rally.

3. Kinghelm (www.kinghelm.net) has successfully passed the renewal audit of its ISO9001 quality management system certification.

4. The first co-developed vehicle model between Horizon Robotics and NIO—Firefly—has officially launched.

5. Jiaren Semiconductor has received approval to establish a postdoctoral research station in Zhejiang Province.

6. Qingchun Semiconductor has successfully launched its third-generation silicon carbide (SiC) MOSFET technology platform and unveiled its first main drive chip, the S3M008120BK.

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