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Release date:2025-06-11Author source:KinghelmViews:366
International Tech News:
1. In 2024, the global artificial intelligence (AI) market reached USD 638.2 billion and is projected to exceed USD 2.5 trillion by 2032, with an average annual growth rate of over 20%.
2. Apple has announced a series of AI features, including the release of the underlying technology of Apple Intelligence through moderate updates to its software and services, laying a foundation for future development.
3. Hygon Information has acquired Sugon (Zhongke Shuguang) in a transaction valued at RMB 11,596,655,700 (approximately RMB 116 billion).
4. GlobalFoundries, a major semiconductor foundry, plans to invest an additional EUR 1.1 billion over the next few years into its wafer fab located in Dresden, the capital of Saxony, Germany.
5. Recently, domestic media coverage of "Interpretation of Kinghelm VIS Standardization System" and "Explanation of SLKOR Brand Visual Identity System (VIS Version 25.04)" has been in full swing, helping boost the brand influence of Kinghelm (www.kinghelm.net) and SLKOR’s “kinghelm” and “slkor” brands.
6. The AI-powered fully automated processor chip hardware-software co-design system, "Enlighten", has been officially released.
Domestic Tech News:
1. Shenzhen Shangdingxin Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange (HKEX).
2. EVE Energy plans to issue H shares and list on the Main Board of the Hong Kong Stock Exchange.
3. The next battlefield for "Made in China" — general-purpose robotics is flourishing across the board.
4. The groundbreaking ceremony for the Phase I of the Power (FRED) Chip Capacity Expansion Project for Automotive Electronics by Yangzhou Guoyu Electronics Co., Ltd. was held in Yangzhou.
5. Zhejiang Lishui Zhongxin Wafer Semiconductor Materials Co., Ltd. held a production line inauguration ceremony for its 12-inch polished wafer facility.
6. Suzhou Kaixin Semiconductor Materials Co., Ltd. has commenced construction of a new project with an annual capacity of 30,000 tons of semiconductor-grade materials and 13,500 tons of supporting materials.
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