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Quectel Communication accelerates its entry into the Wi-Fi and Bluetooth markets, launching four high-performance module products

Release date:2024-03-27Author source:KinghelmViews:111

On March 12th, Quectel Communication, a leading global provider of overall solutions for the Internet of Things (IoT), officially announced the launch of four new Wi-Fi and Bluetooth module products. This move aims to continually meet the growing application demands of the IoT industry and is committed to providing innovative one-stop solutions for diversified scenarios such as smart homes, industrial interconnection, energy storage, and charging piles.

 

The newly released short-range series includes two modules that support Wi-Fi and Bluetooth, FCU741R and FCS950R, as well as two Bluetooth modules, HCM010S and HCM111Z. This series of modules provides end customers with more product options, flexibly meeting market differentiation needs in terms of size, cost, power consumption, and more.

 

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Zhang Dong, the COO of Quectel Communication, also stated, "Short-range communication technologies are widely used in areas such as smart homes, industrial interconnection, and charging piles. We continue to introduce new Wi-Fi and Bluetooth module products because we see the broad development prospects brought by these emerging markets. The four Wi-Fi and Bluetooth modules launched by Yi Yuan allow IoT end customers to choose modules that best suit their use case needs, meeting the market demand for low power consumption, efficient design, compact size, and high-performance modules."

 

 

Wi-Fi + Bluetooth combination module

The Quectel Communication FCU741R is a high-performance Wi-Fi 4 module that supports both 2.4 GHz and 5 GHz dual-band frequencies for WLAN connections, providing a data transfer rate of up to 150 Mbps. This module features a compact package with dimensions of only 13.0 mm x 12.2 mm x 2.25 mm, helping customers effectively reduce product size and optimize costs, making it an ideal choice for many size-sensitive applications. Additionally, the ultra-compact design of the FCU741R can significantly reduce the workload in design and development for customers, thus accelerating time to market for products.

 

In terms of product lifecycle usage, the FCU741R offers a wide operating temperature range from -20°C to +70°C and a reliable USB 2.0 interface, expanding its applicability to various outdoor scenarios. Furthermore, it supports two antenna designs: the first-generation RF coaxial connector and external pins, making the FCU741R an ideal choice for robust and durable designs.

 

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The Quectel Communication FCS950R is a module that simultaneously supports Wi-Fi 5 and Bluetooth 4.2. It is based on the reliable SDIO 3.0 interface and offers two optional configurations for operating temperature: -20°C to +70°C and -40°C to +85°C. This module enables high-speed, low-power WLAN wireless transmission, meeting the diverse requirements of industrial and commercial applications. Additionally, the FCS950R supports multiple standard protocols, including IEEE 802.11a/b/g/n/ac. In 802.11ac mode, it can achieve data rates of up to 433.3 Mbps, ensuring stable wireless network connections.

 

Similar to the FCU741R, the FCS950R aims to address size constraints and production efficiency issues. Firstly, in terms of size design, its ultra-compact dimensions of 12.0 mm x 12.0 mm x 2.35 mm and lightweight advantage of only 0.58g make it a superior choice for many scenarios with strict size requirements. Secondly, the module adopts laser-engraved labels that dissipate heat faster and are less prone to information erasure, making it suitable for large-scale, automated production. This can effectively help reduce production costs and improve production efficiency.

 

 

High-performance MCU Bluetooth module

Quectel Communication has also launched two high-quality Bluetooth products as part of its Bluetooth product portfolio. This includes the high-performance MCU Bluetooth module HCM010S, which is equipped with an ARM Cortex-M33 processor, along with 64KB SRAM and 768 KB flash memory built in. These features empower terminal applications to run more smoothly and without delays, making it particularly suitable for demanding low-power IoT applications.

 

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It is worth mentioning that the HCM010S utilizes a surface-mount LCC + DIP package, with a compact size design of 20.0 mm × 15.6 mm × 2.4 mm, making it compatible with a variety of terminal structural designs, especially catering to the specific requirements of small-scale IoT terminals. Additionally, the HCM010S supports an ultra-wide operating temperature range from -40°C to +105°C.

 

With the increasing demand for multi-to-multi communication in industries such as smart lighting, smart buildings, and smart homes, the HCM010S enhances network scalability and node count by supporting low-power Bluetooth (BLE), Bluetooth Mesh technology, and standard Bluetooth mesh networks to meet the needs of these markets. Furthermore, the module also supports an output power of up to +20 dBm to achieve longer transmission distances, ensuring robust and reliable communication. Importantly, the HCM010S features Secure Vault, providing enhanced IoT security solutions for terminals.

Similarly, the HCM111Z, as a high-performance MCU Bluetooth module, is equipped with a Cortex-M3 processor and supports BLE 5.3, with a high frequency of up to 48 MHz, 48 KB SRAM, and 512 KB flash memory built in, supporting low-power Bluetooth standard protocols such as GATT and HID. What sets the HCM111Z apart from typical Bluetooth modules is its built-in audio codec (optional), enabling microphone pickup and audio playback, making it ideal for integration into smart voice remote controls, smart toy cars, sports and health devices, and household appliances.

 

As an ultra-compact Bluetooth module, the HCM111Z adopts a surface-mount package, achieving a compact size design of 15.0 mm × 12.0 mm × 2.25 mm, while also offering various optional specifications such as RF coaxial connectors, external pin antennas, PCB antennas, and more. Additionally, the HCM111Z provides up to 13 GPIO interfaces, enabling functions such as UART, SWD, SPI, I2C, ADC, and PWM in the QuecOpen® solution; it also supports Bluetooth low-energy mode, significantly enhancing the adaptability of the HCM111Z to multiple application areas, particularly in smart home and industrial IoT scenarios.

 

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Security assurance accompanies supporting services

Quectel Communication modules have always prioritized security as a core aspect. Therefore, in the development of these four modules, from product architecture to firmware/software development, they adhere to industry-leading practices and standards. They not only undergo third-party independent testing to mitigate potential vulnerabilities but also implement security practices such as generating SBOM and VEX files, firmware binary analysis, throughout the software development lifecycle to ensure the security and reliability of the products.

 

Furthermore, Quectel provides a wide range of antenna options for its numerous modules, including embedded antennas and external antennas, showcasing remarkable flexibility and extensive compatibility to meet the unique requirements of different projects. This initiative not only significantly enhances the quality and speed of wireless connections but also ensures that customers can enjoy an exceptional user experience during usage. Quectel Communication always upholds a customer-centric approach, offering antenna design guidance during the product design phase and providing full support during subsequent certification tests and deployment processes, thereby helping customers effectively reduce terminal development costs and accelerate time to market for their products.

 

Disclaimer: This article is excerpted from the Quectel Communication official account on the internet. The views expressed in this article are solely those of the author and do not represent the views of Quectel or the industry. This article is intended for reposting and sharing purposes, supporting the protection of intellectual property. When reposting, please indicate the original source and author. If there is any infringement, please contact us for removal.

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