International Tech News:

1. Driven by emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, the global semiconductor industry continues to expand, fueling the rise of advanced packaging technologies as a key development direction.

2. The 2026 China Semiconductor Advanced Packaging Conference & Exhibition will be held on March 22–23, 2026, in Pudong, Shanghai, China.

3. Siemens’ Electronic Design Automation (EDA) division is reportedly planning to suspend support and services for mainland China.

4. AT&S (Austria Technologie & Systemtechnik AG), a global leader in high-quality semiconductor packaging substrates and printed circuit boards, has officially commenced operations at its new facility in the Kulim Hi-Tech Park, Malaysia. The plant is now fully equipped for mass production.

5. Kinghelm (www.kinghelm.net), a national high-tech enterprise, is currently hiring 8 sales engineers for Beidou GPS antennas and connectors, as well as 3 high-speed connector R&D engineers. Recommendations are welcome.

6. Intel and SoftBank have jointly established "Saimemory" to develop stacked DRAM as an alternative to HBM.

Domestic Tech News:

1. HKC Corporation Limited plans to invest approximately RMB 10 billion to build an all-color M-LED advanced display chip production base in Shunqing District.

2. Zhuhai has introduced new policies offering up to RMB 30 million in funding to support AI and robotics R&D, including the provision of "computing power vouchers" and "model vouchers" to assist enterprises.

3. Guangdong LeapFive Technology has launched LeapAIET, an integrated development platform for RISC-V edge AI, aimed at addressing key industry challenges.

4. Digua Robotics, a subsidiary of Horizon Robotics-W (9660.HK), has completed a USD 100 million Series A financing round.

5. Baidu (Shandong) Artificial Intelligence Co., Ltd. has been officially established, with Wang Sheng as its legal representative and a registered capital of RMB 10 million.

6. Simou Technology and AutoNavi Software Co., Ltd. have officially signed a three-year strategic cooperation agreement in Hong Kong. The two parties will collaborate in smart equipment, intelligent transportation, and smart city development, jointly promoting the growth of the low-altitude economy and intelligent mobility industries.

Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.