Release date：2021-12-28Author source：KinghelmViews：434
Shenzhen jinhangbiao Electronics Co., LtdFounded in 2007, shenzhenkinghellmelectronco., Ltd. is a national high-tech and dual soft certification enterprise, "senior member unit of China satellite navigation Association", an enterprise with ISO9001 (04617q13625ros) quality management certification system, and is improving iatf16949 automobile quality management system. Its main business is the R & D, production and sales of Beidou satellite navigation and IOT terminal application hardware, and www.bds666.com Com logistics information intelligent system solution.
The impact of hardware on throughput can be distinguished from chip selection, layout design, RF index debugging and die structure. Here, the small series of golden beacon can only be briefly summarized. Then, let's talk to you about the hardware factors that determine Wi Fi throughput（IPEX terminal）What are there?
a) Chip selection --- select the chip suitable for product application
Parameters related to throughput include phylayerdadatarate, supportinterface, typicalconductedtxpower, typicalevm, etc. in addition, the chip's ability to resist packet loss needs to be measured. The theoretical rate of the physical layer and the type of communication interface supported will directly determine the throughput of the product designed by this chip, the power determines the transmission distance, and the EVM determines the signal modulation quality.
b) Layout design (not described in detail here)
It mainly focuses on the use of si9000 (or other tools) to select the reference layer, the length of microstrip line 50ohm, the bending and impedance control of routing, the isolation of multi-channel Wi Fi signals, the processing of Wi Fi power supply, as well as the layout, thermal design and shielding design of interference devices, which will affect the Wi Fi RF indicators.
c) Conducted RF index commissioning
1. Transmission power. The power can be adjusted in design according to the actual application of the product. The power is directly related to the distance of transmission.
2. Focus on EVM here
It measures the offset degree of the ideal constellation position of the modulation mode corresponding to the demodulated signal. If the EVM is too poor, it will lead to symbol error, data can not be confirmed and received, deteriorate into error rate, and cause packet loss.
The anti packet loss capability of the equipment is mainly related to the chip capability and layout layout, and the performance can also be optimized through shielding measures. It should be noted that the verification method of conduction can only partially reflect the anti-interference capability of the product, and the sensitivity test of wi fiota is a more comprehensive verification.
d) Design of die structure
The main concerns are whether the space reserved for antenna design, antenna assembly, and the appearance and material of the whole structure will affect wireless signal transmission.
e) Manually welded test board
If the chip or module of the test board and the IPEX terminal are manually welded, the throughput performance will also be affected.
f) Welding of antenna
If the welded antenna is used, the exposed coaxial core wire welded to the feed point of PCBA antenna will also affect the throughput; If it is a metal patch or plug-in antenna, the amount of tin on it and the flatness of antenna mounting will also affect the throughput.
The above is the introduction of the relevant contents brought by the Xiaobian of Laijin navigation mark. I hope it will help you. Thank you for reading!
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