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Kinghelm and Slkor May Celebration Banquet Successfully Held
2026-06-15
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International Tech News:
- Global semiconductor equipment leader Applied Materials has officially commenced mass production at its new Tampines campus, with a total investment of US$500 million (approximately RMB 3.4 billion).
- Samsung Electro-Mechanics’ Vietnam Phase II project has received an additional investment of approximately US$1.63 billion, bringing the total project investment to about US$2.91 billion.
- By 2027, global shipments of AI server computing ASICs are expected to triple compared to 2024.
- SK Hynix plans to begin mass production of its next-generation 375-layer 3D NAND flash memory by the end of 2026.
- On the evening of June 12, the May celebration banquet of Kinghelm (kinghelm.com.cn) and Slkor was successfully held. The champion team, Kinghelm Sales Division One, led by Director Zeng Qingrong on behalf of General Manager Song Shiqiang, celebrated together with all team members. Congratulations on the outstanding performance, and best wishes for a strong sales breakthrough in June!
- Samsung Electronics is considering building an advanced semiconductor packaging facility in Gwangju, South Korea.
Domestic Tech News:
- The “Artificial Intelligence + Information and Communication Innovation Development Implementation Plan (2026–2028)” was officially released.
- The Yixin Optoelectronics smart display glass cover project, with a total investment of RMB 1.2 billion, has officially entered production.
- The Pilot Laser Core Manufacturing Base project has started construction, with a total investment of RMB 2 billion.
- Lightworks Optics plans to raise no more than RMB 1.054 billion, with over RMB 500 million allocated to the industrialization of AR optical products.
- The second phase of Guangdong Epass AI high-speed copper-clad laminate and packaging substrate base project has commenced construction, with a total investment of RMB 1 billion.
- Xi’an Unigroup Guoxin Semiconductor Co., Ltd. plans to list on the Beijing Stock Exchange.
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