News & Information

Slkor’s English-Language Article Published by Over 1,000 Well-Known Media Outlets Including Australian News International Tech News: NXP plans to adjust prices for some distribution and direct-supply product lines, with the new rules effective January 1, 2027. Qualcomm’s high-bandwidth computing memory architecture has completed preliminary validation. This technology will be an important part of Qualcomm’s next-generation Dragonfly data center AI accelerator. WSTS forecasts that the global semiconductor market will reach USD 1.51 trillion in 2026. TrendForce estimates that in 2026, Marvell and Lumentum will rank fourth and eighth, respectively, by revenue share in the wired communication semiconductor market. Slkor’s (www.slkoric.com) popular article "Slkor Upgrades Its Three Huaqiangbei Stores, Further Strengthening Its Growing Brand Influence" has spread widely at home and abroad. Australian News, Mexico Online, Singapore Online, Brazil Online, France Express, and more than 1,000 other well-known media outlets have republished it. German chemical company BASF will build a new electronic materials production base in Nanjing Jiangbei New Materials Science and Technology Park, China. Domestic Tech News: The main venue for the 2026 APEC Leaders’ Informal Meeting is the Shenzhen International Exchange Center, located in the north area of Xiangmihu, Futian District, Shenzhen, China. XuanTie C950, developed by Alibaba DAMO Academy, won the "Annual Major Innovation Breakthrough Product Award" at the 21st "China Chip" awards in 2026. Zhongji Innolight’s revenue in Q3 2026 was RMB 27.769 billion, up 171.83% year on year; net profit attributable to parent was RMB 8.587 billion, up 173.74% year on year. From November 3 to 6, the 2026 China International Exhibition on Public Safety and Security (Security China) is being held at China International Exhibition Center (Shunyi Hall), Beijing. Reports say that DeepSeek’s next-generation large model V5 will be pre-trained on Ascend chips. The land acquisition for Phase II of Pangu Semiconductor, a key industrial project in Nanjing, has officially been approved by the municipal government. Shenzhen Acts as a Good Host and Welcomes APEC CHINA 2026 Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. High-Capacitance MLCC Shortage Expected to Persist Through 1H27 Date: October 29, 2026Summary:TrendForce says the shift of AI workloads from training to inference and AI agents is driving a new wave of CPU demand, and because each CPU needs power modules and DDR5 memory, high-capacitance MLCC usage on CPU motherboards and memory modules is rising sharply. Shipments of NVIDIA's Vera Rubin platform are expected to ramp month by month from 4Q26, and AMD has begun procuring specialized high-capacitance MLCCs for its MI450 platform, so ODMs expect the tightest high-end MLCC supply in 1Q27 and 2Q27. Consumer demand stays weak: major notebook ODMs expect 4Q26 orders to fall 10-15% year on year, and spot prices for low- and mid-capacitance consumer MLCCs slipped about 5% in early October before finding a floor. Shortages have also spread to communications-grade components used in optical modules, while nickel, copper and silver costs keep climbing, with Japan's import price index up 24.5% year on year in September.Importance:Price negotiations for 1Q27 begin in November 2026 and Japanese suppliers are expected to follow Samsung Electro-Mechanics with increases, so AI board designs face continued allocation and higher cost on high-end capacitors while spillover consumer-grade orders move to Taiwanese and Chinese suppliers.Source: TrendForce 2. Murata Plans About 1 Trillion Yen in Capacitor Capacity for AI Date: October 30, 2026Summary:Murata Manufacturing intends to invest about 1 trillion yen (roughly $6.3 billion) to expand capacitor production capacity over five years for AI demand, with reports saying the plan is aimed at doubling fiscal 2030 sales volume and that expansion was brought forward because existing capacity falls far short of market requirements. Ibiden is also adding substrate capacity, and Korean media describe the Japanese suppliers squaring off with Samsung Electro-Mechanics and LG Innotek for share in AI components. Murata separately signed a three-year AI production reform contract with Accenture. TrendForce notes that even with accelerated investment, new capacity is unlikely to come online before 2028.Importance:Multi-year, multi-billion-dollar commitments show component makers treating AI demand for MLCCs and substrates as structural. For buyers the near-term consequence is continued allocation and long lead times on high-end parts, with no meaningful supply relief expected before 2028.Source: Nikkei Asia; Murata Manufacturing; TrendForce 3. SK hynix Says DRAM and HBM Effectively Sold Out to 2029 as Prices Set Records Date: October 28, 2026Summary:SK hynix reported record third-quarter revenue with an operating margin near 80%, and according to TrendForce said DRAM and HBM are effectively sold out to 2029 with 14 long-term agreement customers signed. Management described HBM orders at more than twice available supply, expects DRAM demand to grow in the mid-20% range next year, and forecasts that the memory shortage will last through 2030. October brought new record DRAM prices, with PC DRAM contract prices for 4Q26 forecast to rise up to 18% as capacity is diverted to AI servers, while the NAND flash rally ended after 21 months of gains and 512Gb TLC spot prices fell about 9% amid smartphone promotions in China. Samsung and Micron have issued similar multi-year sell-out statements.Importance:Memory remains the largest cost driver for servers, PCs, consoles and mobile devices, and long-term agreements show suppliers favoring guaranteed AI demand over spot business. Buyers should plan for sustained DRAM price pressure and allocation rather than short-term relief.Source: SK hynix; TrendForce; Chosunbiz 4. AI Boom Tightens Board and Packaging Supply: 30-Month PCB Lead Times, CoWoS Hike in View Date: October 27, 2026Summary:Nikkei Asia reported that the AI boom is creating a circuit board crunch across the global tech supply chain, as high-layer-count, high-density boards for AI servers absorb capacity that PCs and consumer devices also depend on. By the end of the week, industry media reported that some PCB orders are taking up to 30 months to fulfill. Intel added to the pressure by disclosing that it is shifting fab capacity from consumer PC CPUs to server Xeon processors, a move framed around one of the most significant supply shortages on record. TSMC is reportedly weighing a further price increase of up to 20% for CoWoS advanced packaging, since AI GPU and custom ASIC demand continues to stress its packaging supply.Importance:Cost and lead-time pressure is spreading from memory and passives into boards, substrates and advanced packaging, the segments where capacity additions are slowest. Early forecasting, second-source board qualification and longer design freeze windows are becoming standard practice.Source: Nikkei Asia; TweakTown; Tom's Hardware 5. Wingtech Reports No Substantive Progress in Nexperia Talks as Discrete Shortage Reaches Automakers Date: October 30, 2026Summary:Shanghai Wingtech Electronics said in an emergency stock exchange announcement that differences with the Netherlands parent of Nexperia remain substantial and that negotiations have made no substantive progress; the shares closed limit up at CNY 11.4. The standoff, which began with Dutch state intervention in Nexperia in 2025, continues to separate the China operations of one of the world's largest makers of diodes, protection devices and power MOSFETs from its European headquarters. Nexperia said its requests for financial data from the China units met no substantive response and that it is expanding production outside China. Reports said the resulting component gap forced automotive production halts involving customers such as Honda and Bosch, and over the weekend China granted an export exemption intended to ease the chip shortage for automakers.Importance:Uncertainty around Nexperia's China capacity keeps a real risk premium on automotive-grade discretes and pushes OEMs toward qualified second sources. It also strengthens the case for localizing component supply and safety stock in China, where these diodes and MOSFETs are largely manufactured.Source: Shanghai Wingtech; JW Insights; Evertiq 6. HP, Asus and Acer Move Some PC Production Back to China as the Component Squeeze Tests China-Plus-One Date: October 28, 2026Summary:Reports said HP, Asus and Acer are shifting some notebook production back to China after years of moving volume to Vietnam and India, and Chinese industry media framed the reversal as evidence that de-risking plans cannot match China's supplier density. The change comes while memory, PCB and passive-component shortages stretch lead times and raise prices, and overseas lines still depend on Chinese boards, materials and components for finished assembly. In the same week the Shenzhen international electronic components exhibition opened on October 27, with AI computing hardware and liquid cooling as its dominant themes, underlining how much of the component innovation pipeline still runs through China.Importance:When brand volume returns to China, local component availability, short lead times and one-stop BOM coverage again become decisive in where products are built. Chinese suppliers of boards, passives, connectors and cooling get direct access to demand that had been planned to move offshore.Source: The Times of India; JW Insights; Nikkei Asia At Kinghelm At Kinghelm, we follow MLCC allocation, memory contract pricing, board and packaging lead times and discrete-component supply, because they set the pace of our customers' build plans. With high-end capacitor shortages extending into 1H27 and automotive discretes under pressure, we help customers qualify alternatives early across RF antennas, connectors, wire harnesses, precision cables and interconnect solutions for AI infrastructure, automotive and industrial electronics. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

Slkor BTA12-600B Is Suitable for Power Control and Switching Circuits, etc. International Tech News: Reports say Samsung Electronics plans to shut down all 8-inch wafer foundry lines by the end of 2030 and fully exit the 8-inch foundry business. Marvell will acquire data center optics manufacturer Lumentum Holdings for USD 115 billion. Wolfspeed has commercialized its proprietary transparent silicon carbide (TSiC™) technology, further expanding silicon carbide applications in AR optics and quantum computing. South Korea's exports in October 2026 reached USD 115.28 billion, with semiconductor exports exceeding USD 50 billion (USD 56.44 billion). TrendForce forecasts that PC DRAM prices will rise 13% to 18% in the fourth quarter of 2026. Ibiden will invest an additional approximately JPY 151 billion to expand production of IC substrates for AI servers. Domestic Tech News: BYD has become an official partner of APEC 2026, and nearly 700 Denza vehicles will fully support transportation for the meeting. Xiaomi invested RMB 1.7 billion to take a stake in Shenzhen Sunwoda, becoming the third-largest shareholder after Li Auto. Slkor Semiconductor (www.slkoric.com) received the "Strategic Partner" certificate from the Chip Growth Forum in 2026. XHEART XinxinHang released the large-model chip X7 Ultra and announced that the X7 series has been in mass production for 8 months, with cumulative shipments exceeding 200,000 units. Xinlian Dongli completed nearly RMB 2 billion in Series C financing, led by China Mobile Chain Leader Fund. Apple and Alibaba reached a partnership to integrate the Tongyi Qianwen large model into Apple Intelligence, expected to launch to Chinese users with the official release of iOS 27.3 in December. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Kinghelm International Official Website Traffic Surges! International Tech News: Murata Manufacturing will invest JPY 1 trillion (USD 6.3 billion) over five years to meet growing demand for advanced electronic components for AI servers and devices. The Greek government has opened public consultation on a proposed national strategy for semiconductors and microelectronics, with a deadline of November 12. Global smartphone SoC shipments plunged 21% YoY in Q3 2026, with the mid- and low-end market hit hardest. Samsung is accelerating efforts to expand the market share of its self-developed Exynos chips. The international version of Kinghelm's official website (www.kinghelm.net) has completed a full upgrade. Song Shiqiang stated that he will continue to promote the international development of the kinghelme brand. OpenAI is seeking to raise up to USD 20 billion in a new funding round. Domestic Tech News: At 11:18 on November 1, Shenzhen, host city of the 2026 APEC "China Year," released the theme song "Meet You in the City of Miracles," and the MV of the same name had its global simultaneous premiere. The AMD Embedded Summit will be held on December 1, 2026, at Hilton Shenzhen Shekou Nanhai in Nanshan District, Shenzhen. Xinxin Hangtu is researching next-generation compute chips with up to 3000 TOPS. Xpeedic released EDA 2027, adding 3DIC PDK and an optoelectronic co-simulation platform, and launched the AgentEvo agent platform and Physics AI trustworthy physical intelligence. Accelink Technologies' high-end optoelectronics and silicon photonics chip device industrialization project (Phase I) has started construction, with a total investment of RMB 10.2 billion. ChangXin Technology expects to launch a new generation of DDR5 RDIMM server memory integrating 4F² architecture and hybrid bonding technology by the end of 2026. APEC CHINA 2026: Meet in Shenzhen, Witness Miracles Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor's second Huaqiangbei store completes another image upgrade International Tech News: Japan's chip manufacturing equipment sales in September exceeded JPY 600 billion, up 48.2% year on year. Intel fabs introduced AI agents, speeding up equipment anomaly detection by 30%. Nomura Securities' latest report and industry insiders said the memory chip shortage will continue until 2028. The Financial Times reported that Toyota is entering the humanoid robot sector and plans to deploy 400,000 robots. IBM connected two quantum chips for the first time, achieving cross-chip quantum state transfer accuracy of up to 99%. Sources said LG Display will jointly invest RMB 1 billion with Guangzhou Development District Holding Group to expand the OLED module production line at its Guangzhou plant. Domestic Tech News: The 2026 APEC Summit in Shenzhen will be attended by 21 official member economies, including China, Thailand, Australia, Singapore, Hong Kong, China, Canada, South Korea, Japan, and New Zealand. Biwin Storage achieved operating revenue of RMB 6.142 billion in the third quarter of 2026, up 130.67% year on year. Slkor (www.slkoric.com)'s three stores in Huaqiangbei recently completed another image upgrade, with the terminal service experience improved simultaneously. Zhengzhou BYD New Materials Industrial Park has a total investment of RMB 215 million to build a silicon carbide substrate processing line. UMC's wafer shipments in the third quarter were about 1.2 million 12-inch wafers, a record high, and its capacity utilization rate rose from 85% in the second quarter to 92%. Relevant authorities notified that China plans to add 34 leading-level smart factories, including Xiaomi's high-end new energy vehicle super smart factory. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

APEC CHINA 2026 Countdown, Photographed in Huaqiangbei International Tech News: The industry is accelerating the commercial deployment of 5G-Advanced (5G-A) networks, with 6G poised to follow. NVIDIA (NVDA-US) acquired the open-source platform Hugging Face for USD 12.93 billion (about RMB 86 billion). Infineon launched the ENDOPACK brand and its first product, ENDOPACK Cell, an automotive-grade certified high-voltage chip embedding solution that can be directly integrated into PCBs. The global silicon photonics market is expected to grow from USD 1.82 billion in 2023 to USD 25.2 billion in 2030, with a compound annual growth rate of more than 28%. Recently, the English version of Kinghelm's (www.kinghelm.net) popular article "Ten Years of Growth, Striving to Become a Leader in the Industry" was published by UK Tech Frontline, English Morning Post, The Times, European Times, and more than 100 other mainstream overseas media outlets, further expanding the brand influence of Kinghelm and Slkor (www.slkoric.com). AI giant Anthropic officially submitted its S-1 filing and plans to list on Nasdaq under the ticker symbol "ANT". Domestic Tech News: The Shenzhen Municipal Human Resources and Social Security Bureau issued the "Notice on Advocating Flexible Work Arrangements During the APEC Meeting Period", advocating that all enterprises citywide implement flexible work arrangements during the APEC meeting period (November 16 to 20). The Zhongguancun High-Performance Chip Interconnect Technology Alliance (HIPI Alliance) will hold HIPI CHIPLET FORUM 2026 in the Beijing Economic-Technological Development Area from November 16 to 17, 2026. The 2027 (8th) Semiconductor Investment Annual Conference and IC Fengyun Awards Ceremony will be held in Chengdu on December 19, 2026. The 5th Nandujiang Smart Healthcare and Rehabilitation Industry Summit Forum will be held in Haikou, Hainan Province, on November 13, 2026. Wccftech reported, citing other reports, that Chinese smartphone manufacturers are reusing components recycled from old phones in new models, with DRAM accounting for the largest share. Chongqing Wuqi Microelectronics Co., Ltd. launched the ultra-low-power dual-band Wi-Fi 6 chip WQ9002. UK Tech Frontline publishes the English version of the Kinghelm article Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Kinghelm and Slkor Hold New Employee Tea Gathering International Tech News: Infineon will build a new 300mm wafer facility in Europe to mass-produce next-generation gallium nitride power semiconductors. SK Hynix's Q3 FY2026 revenue was KRW 104.6155 trillion, and operating profit was KRW 83.3338 trillion, with quarterly revenue exceeding KRW 100 trillion for the first time. NVIDIA will invest USD 3 billion in Meta to expand cooperation with Meta on the Muse intelligent assistant and Muse series models. Micron's next-generation DRAM gives up the 4F² route and instead continues the existing 6F² architecture, betting fully on wafer bonding and 3D stacking technology routes. Japan's SoftBank plans to invest USD 50 billion in Malaysia, focusing on technology fields such as AI, semiconductors, and digital infrastructure. Samsung Electronics plans to use AI technology to shorten the R&D cycle of new semiconductor materials from 5 years to 2 years, and increase the screening volume of candidate materials by more than 5 times. Domestic Tech News: Dataforce data shows that in Q3 2026, Chinese-brand car registrations in Europe roughly doubled year on year, with a market share of 12.7%, surpassing Japan's 11.9% for the first time. Shenzhen is China's third APEC host city after Shanghai and Beijing; the theme of this year's event is "Building an Asia-Pacific Community to Promote Common Prosperity." On the afternoon of October 27, Kinghelm and Slkor (www.slkoric.com) held a new employee tea gathering at the company headquarters. Everyone closed the distance through relaxed exchanges, helping newcomers quickly integrate into the team. Shannon Xinchuang achieved operating revenue of RMB 106.426 billion in the first three quarters of 2026, with net profit attributable to the parent company of RMB 5.340 billion, up nearly 14 times year on year. China Information and Communication Technologies Group, together with Peng Cheng Laboratory and others, achieved 3.2 Pb/s real-time optical transmission over 24-core optical fiber, surpassing 2.5 Pb/s in March this year. V-Test Semiconductor will invest RMB 1 billion to build the Phase II project of its Shanghai headquarters base, expanding integrated circuit testing capacity. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Articles from Kinghelm and Slkor’s "Huaqiangpedia" column have been featured on Elecfans! International Tech News: Musk warned that the financing environment for artificial intelligence (AI) data centers is tightening rapidly, and more than 200 new-type cloud service providers (neoclouds) may face bankruptcy and an industry consolidation wave. Intel has agreed to acquire Israeli startup Classiq Technologies Ltd. to advance its quantum computing strategy. Texas Instruments (TI): semiconductor content per humanoid robot is about US$500–1,000, with mass production expected to begin in 2027. Emerging non-volatile memories represented by MRAM, PCRAM, ReRAM and FRAM have become core underlying support for adapting to next-generation AI computing power and reconstructing new computing architectures. "Huaqiangpedia: Which Industry-Shaping Companies and Figures Came Out of Huaqiangbei?" and "Huaqiangpedia: Exposing the ‘Cash on Delivery Scam’ in Huaqiangbei Anti-Fraud," produced by Kinghelm (www.kinghelm.net) and Slkor (www.slkoric.com), have been published on Elecfans! Arm announced an update to its new-generation Mali GPU architecture, a unified software scheduling solution for automotive, mobile and embedded terminals. Domestic Tech News: ZTE released its 2026 financial report: first-three-quarter revenue was RMB116.8 billion, up 16% year on year, with computing power revenue accounting for 38%. Mahexin Technology, under Li Auto, signed a first-round financing agreement worth RMB1.625 billion, with a maximum post-money valuation of RMB17.1 billion. XHEART Xinxin Hangtu completed a strategic financing round of nearly RMB5 billion. China’s 2026 Excellence-level Smart Factory project list was publicly announced, and Lianxin’s "Digital-Intelligent Integrated Circuit Manufacturing Smart Factory" was officially selected. The list of Guangdong Province’s first batch of 211 digital economy innovative enterprises was publicly announced, with 32 Shenzhen enterprises selected. According to statistics, the AI GPGPU market for Chinese enterprises increased from RMB1.9 billion in 2021 to RMB11.8 billion in 2025, with a compound annual growth rate of 58.1%. Kinghelm products are widely used in automotive and medical fields. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. NVIDIA Reportedly Standardizes NVHBM Base Dies on TSMC 3nm Date: October 19, 2026Summary:NVIDIA has reportedly asked Samsung, SK hynix and Micron to use TSMC's 3nm process for the base dies of its next-generation NVHBM memory. The move would standardize HBM base-die production at TSMC and bring the three memory suppliers onto a common foundry platform, according to TrendForce and Korean media reports. Base dies handle memory control and interface functions, so process-node and packaging choices directly affect bandwidth, power and yield.Importance:Tightens the link between HBM and leading-edge foundry capacity, giving TSMC a larger role in AI memory supply and making 3nm allocation, CoWoS packaging and base-die qualification key variables for HBM4 and beyond.Source: TrendForce; Reuters; The Next Web 2. CXMT Expects Over Eightfold Revenue Jump as Memory Squeeze Persists Date: October 19, 2026Summary:CXMT expects revenue to rise more than eightfold this year amid the global memory shortage, according to The Wall Street Journal, after the Chinese DRAM maker reported a record nine-month profit. Its shares fell nearly 8% as investors looked past the earnings turnaround and focused on valuation, execution and the sustainability of memory pricing. CXMT is also reportedly preparing a NAND push while rival YMTC works on DRAM, broadening competition between China's two largest memory companies.Importance:Shows how quickly China's memory suppliers are scaling during the AI-driven shortage, while cross-entry into NAND and DRAM could reshape supply relationships, pricing and technology competition over the next several years.Source: CXMT; The Wall Street Journal; CNBC 3. YMTC to Mass Produce 9,600 MT/s LPDDR5X and Expand into DRAM Date: October 23, 2026Summary:YMTC plans to begin mass production of LPDDR5X memory running at 9,600 MT/s, with reports saying the device targets 4F2 memory cells and marks the Chinese NAND maker's move into DRAM. YMTC has also overtaken Samsung in China's NAND flash market, according to KED Global, strengthening its position just as it prepares for an IPO. The company is betting on premium eSSD products and high-speed mobile memory to compete with Samsung, SK hynix and Micron.Importance:Adds a new China-based DRAM entrant and a stronger NAND competitor, increasing the likelihood of price and share shifts in mobile memory and enterprise storage while giving buyers more supply options outside Korea and the United States.Source: YMTC; TechPowerUp; KED Global 4. Samsung Electro-Mechanics MLCC Lead Times Reach 52 Weeks as AI Demand Surges Date: October 21, 2026Summary:Samsung Electro-Mechanics' MLCC lead times have stretched to about 52 weeks, with new orders now taking roughly a year to fulfill as AI server demand overwhelms available capacity, according to industry reports. The company is also expanding FC-BGA and ABF substrate production through a strategic partnership with NVIDIA, and reports say it will build dedicated capacity for the AI accelerator supply chain. The tightening extends beyond memory into passive components and substrates, two areas where capacity additions are slow and qualification cycles are long.Importance:Confirms that AI infrastructure demand is creating shortages in MLCCs and IC substrates, not just logic and memory. Longer lead times raise procurement risk for servers, networking gear and power supplies, and strengthen the case for early allocation and multi-source planning.Source: Samsung Electro-Mechanics; THE ELEC; Chosunbiz 5. DRAM Contract Prices Seen Rising 20% QoQ in Q4 2026 Date: October 20, 2026Summary:TrendForce expects DRAM contract prices to rise about 20% quarter over quarter in the fourth quarter of 2026, slower than the previous quarter's increase but still supported by AI demand and tight supply. The forecast covers conventional DRAM as well as server and mobile segments, where suppliers are prioritizing high-value AI and data-center allocations. Memory makers continue to shift wafer capacity toward HBM and advanced products, limiting availability of commodity DRAM.Importance:Sustains cost pressure across PCs, smartphones, networking equipment and industrial systems that rely on standard DRAM, and reinforces the need for long-term supply agreements, design flexibility and early procurement.Source: TrendForce 6. U.S. Awards $389 Million for Power Semiconductor and Materials R&D Date: October 22, 2026Summary:The U.S. Department of Commerce signed letters of intent for up to $389 million in CHIPS Act R&D awards to four companies developing power semiconductors, power modules and critical materials. Helion would receive up to $175 million for high-voltage power semiconductors and pulsed-power modules, Commonwealth Fusion Systems up to $85 million for RF and radiation-hardened electronics, Vertical Semiconductor up to $73 million for vertical GaN power devices targeting a 2.5 MW AI data-center rack, and Sibelco up to $56 million for ultra-high-purity quartz. The government will receive minority, non-voting equity stakes in the companies.Importance:Directs public funding toward high-voltage, high-efficiency power devices and materials that are increasingly important for AI data centers, grid infrastructure and advanced manufacturing, reducing reliance on overseas suppliers for critical power components.Source: NIST; U.S. Department of Commerce; Reuters At Kinghelm At Kinghelm, we track memory pricing, passive-component lead times and power-device capacity because they directly affect component availability and design cycles. These signals guide our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions for AI infrastructure, automotive and industrial electronics.

Slkor S9012 is a PNP bipolar transistor International Tech News: Due to factors such as the capital market environment, SK hynix has suspended the IPO plan of its overseas subsidiary Solidigm. Intel's Fab 62 wafer fab has entered the construction and equipment installation stage and is expected to begin operations in early 2028. DigiKey will invest USD 100 million over the next 18 months to expand its distribution center to meet a 50% business growth demand this year. Micron Technology announced that its G11 3D NAND flash memory has surpassed 400 layers and will enter mass production in the second half of 2027. Mitsubishi Materials plans to significantly increase production capacity for thermistors used in optical communication equipment; by November 2027, monthly capacity will be raised to 12 million units. Intel will collaborate with AMD to simplify x86 CPU AI development for PyTorch. Domestic Tech News: Huatian Technology plans to invest RMB 3 billion to build Phase II, Stage 2 of its Nanjing advanced packaging and testing industrial base. The 33rd APEC Economic Leaders' Meeting in 2026 will be held in Shenzhen from November 18 to 19, 2026. Slkor's (www.slkoric.com) Chinese official website mobile app has been launched; after downloading, users can open it directly to conveniently access product information and services. iFLYTEK has launched Xingfan WinWork and has created more than 80 types of professional digital employees, covering risk control, contract review, procurement sourcing, material substitution selection, and other work. The R&D and production base project of "Dingtanxin", a local brand under Italy's Tenap Group, has settled in Suzhou. Rumors that NVIDIA's RTX 50 series has been discontinued have disrupted the Huaqiangbei market; since September, prices of its high-end consumer graphics cards have continued to jump. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Logo of the 2026 Shenzhen APEC "China Year" International Tech News: NVIDIA announced cooperation with six supply chain partners—Amkor Technology, Ibiden, KYEC, Samsung Electro-Mechanics, SPIL, and Unimicron—to expand critical manufacturing capacity globally. Apple's first foldable phone, iPhone Duo, will go on sale on October 23, with a base price of more than USD 2,000. Volvo Cars plans to lay off about 2,500 employees globally, including about 2,000 in Sweden. AI cloud service provider Modal plans to introduce NVIDIA's next-generation Vera CPU to run AI Agent-related workloads. Kinghelm (www.kinghelm.net) products such as KH-SMA-K513-G, KH-IPEX-K501-29, KH-TYPE-C-16P, KH-3216-A35, and KH-3216-A27 are selling well both online and offline! Popular product search keywords: multi-function switch, illuminated switch, DIP switch, toggle switch, earphone jack, DC jack, FPC connector, USB connector, waterproof USB, detection switch, limit switch, encoder switch, tactile button, Type female socket, Type-C interface, joystick switch, five-key switch, thumbwheel switch, SMD detection switch, vertical detection switch, through-hole detection switch, SMD encoder switch. South Korea's semiconductor exports from October 1 to 20, 2026, reached USD 27.5 billion, surging 222.5% year on year. Domestic Tech News: In 2026, Shenzhen becomes China's "third APEC city". On October 22, Huaqiangbei Zhifangzhou, as a sci-tech innovation exchange window, welcomed four groups of visitors, leveraging the opportunities of the 2026 Shenzhen APEC. The "2026 China Automotive Chip Innovation Achievements Recommendation List" was released, and Yutai Micro's automotive TSN switching chip YT9911CL was successfully selected as a recommended achievement in the communications category. Cambricon achieved operating revenue of RMB 3.531 billion in Q3 2026, up 104.47% year on year; net profit attributable to parent was RMB 1.404 billion, up 147.74% year on year. Beijing Dabo Nonferrous Metal Solder Co., Ltd. will build a semiconductor bonding materials intelligent manufacturing base project in Changzhou West Taihu. CMOS image sensor supplier SmartSens founder Dr. Xu Chen was honored with the 2025 TEEC Entrepreneurship Achievement Award. The 2026 Ceva Edge Technology Seminar will be held on November 5 at Hilton Shanghai Zhangjiang, and registration is now open. Kinghelm pogo pins and spring contacts Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Song Shiqiang interviewed by LAM Hon-shan, Principal Reporter of RTHK International Tech News: Renesas Electronics released its flagship 32-bit microcontrollers (MCUs), the RX74M and RX74N. Japanese media reported that Canon plans to increase the production capacity of lithography machines for semiconductor back-end processes by 50% by 2029 compared with 2026. Texas Instruments reported third-quarter 2026 revenue of USD 6.06 billion, up 28% year on year. Samsung and SK Hynix plan to produce NAND Flash chips with more than 200 layers at their factories in China. Driven by strong chip demand, Japan's exports in September amounted to JPY 10.97 trillion, up 16.7% year on year. The registered capital of Intel Semiconductor (Dalian) increased from USD 20 million to USD 816 million, an increase of 3,980%. Domestic Tech News: The world's first Primo Domingo® gas-phase high-selectivity etching equipment from AMEC has been successfully delivered. Data show that in the first three quarters of 2026, the output value of Shanghai's integrated circuit manufacturing industry grew by 23.4%, and the output value of its artificial intelligence manufacturing industry grew by 24.8%. Mr. Song Shiqiang gave an exclusive interview to LAM Hon-shan, Principal Reporter of RTHK, at the headquarters of Kinghelm/Slkor (www.slkoric.com), discussing how Chinese technology enterprises can seize the opportunity of the APEC meeting to be held in Shenzhen, tell Chinese brand stories well, and promote their products to the international market. Xiyue Semiconductor power semiconductor project has been signed and settled in Hohhot, with an estimated annual output value of 200 million to 250 million yuan, creating about 140 jobs. TrendForce estimates that server CPU shipments will grow 31% year on year in 2026, and shipment volume is expected to grow by more than 40% in 2027. Weiyi Zhizao and Dongshan Precision will be listed on the Hong Kong Stock Exchange on October 28. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Kinghelm (www.kinghelm.com.cn) products connect the world! International Tech News: Samsung System LSI has decided to adopt a 2nm process to manufacture the external 5G baseband M2800, with development expected to be completed in 2027. Chip company Groq is evaluating the introduction of 3D stacked DRAM packaging technology in its next-generation chips. Intel's Fab 62 is currently installing equipment and is expected to begin operations in early 2028. Terafab, a chip manufacturing joint venture between SpaceX and Tesla, plans to achieve mass production in Q3 2028. Kinghelm (www.kinghelm.net) products including KH-IPEX-K501-29, KH-6X6X5H-STM, KH-6X6X5H-Z2J, KH-6X6X6H-STM, KH-VH-PT3.96, KH-SMA-P-8029, and KH-3216-H0209 are selling well both online and offline! Product hot search keywords: Type-C, SMA, IPEX, MCX, HDMI connectors, automotive wiring harnesses, adapter cables, pin headers, terminals, RF cables, antennas, GPS antennas, RF coaxial connectors, WiFi antennas, BeiDou antennas, built-in antennas, 4G antennas, ceramic antennas, RF connectors, electronic components, sensors, millimeter wave, tactile switches, detector switches, toggle switches, pushbutton switches, micro switches. ESWIN Computing and the internationally renowned RISC-V processor IP company SiFive have officially signed a Golden Partner Alliance memorandum. Domestic Tech News: Honor Smartwatch 6 Pro has been officially released, and its 1.5-inch wearable display has achieved mass production and shipment. The GT1500 series UWB chips from Jieyang Micro have passed the stringent FiRa Core 4.0 certification of the international standards organization FiRa® Consortium. Samsung Electronics plans to upgrade its Xi'an factory in China, with the goal of switching its production line to 286-layer NAND flash by the end of 2026. Xiyue Semiconductor's ultra-high-voltage power semiconductor device production project, with an investment of RMB 558 million, has landed in Hohhot. Changsha Chixin Semiconductor Technology Co., Ltd. has secured exclusive UWB chip supply rights for the Samsung Galaxy SmartTag 3, with expected annual shipments in the tens of millions of pcs. In September 2026, domestic market mobile phone shipments reached 21.856 million units, down 21.7% year on year, including 19.234 million 5G phones, down 20.2% year on year, accounting for 88.0% of mobile phone shipments during the same period. Kinghelm plug-in terminal block Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor SLSRV05-4 ESD anti-static diode International Tech News: Korean media reported that Samsung Electronics plans to enter the photonic integrated circuit (PIC) foundry market starting in 2027. Due to disputes over bonuses and profit sharing, the union at Micron Technology's Taoyuan plant will launch a one-day solidarity strike on October 22. Intel CEO Lip-Bu Tan revealed that the company's large-scale restructuring is about 80% complete. Hanmi Semiconductor plans to launch its Wide TC Bonder wide thermocompression bonding machine in 2027. TrendForce estimates that the global optical fiber supply-demand gap in 2026 will be about 180 million core kilometers, and the shortage may continue until 2028. Samsung Display has developed a 7-inch-class organic light-emitting diode (OLED) prototype and initially expects to launch samples as early as the end of the year. Domestic Tech News: CATL achieved operating revenue of RMB 442.137 billion in the first three quarters of 2026, up 56.19% year on year. Ningbo Pulite Semiconductor Equipment Production and Manufacturing Center was officially put into operation, with a planned annual capacity of 6–8 semiconductor equipment units. Slkor (www.slkoric.com) and Kinghelm regularly conduct internal training. This Saturday at 10 a.m., Chen Suwei, Deputy Director of Kinghelm, will give a lecture, and basketball and badminton team-building activities will be organized in the afternoon, showcasing the team's learning and vitality. Relevant authorities disclosed on the 19th that in the first three quarters of 2026, Shenzhen's total imports and exports reached 4.65 trillion yuan. Among these, the import and export scale of AI-related components such as integrated circuits ranked first in the country, contributing more than 60% of the city's foreign trade increment. In the first half of 2026, IDC statistics showed that global quadruped robot shipments exceeded 49,000 units, surging 92.5% year on year. The registered capital of Changxin Jidian (Beijing) increased from approximately RMB 50.85 billion to approximately RMB 60.18 billion. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Huaqiangbei Museum, photo by a Kinghelm reporter International Tech News: Intel announced exclusive mass production of 300mm indium phosphide silicon photonic wafers, with cumulative shipments exceeding 8 million optical transceivers and 32 million integrated lasers. The global market share of Chinese CMOS image sensor (CIS) companies has risen from 22% in 2023 to 31% in 2025. OmniVision Group, with a 13% share, has surpassed Samsung for the first time to become the world’s second-largest CIS supplier. As AI moves from training to inference and Agentic AI, KV cache, long context, and large-scale data lakes are shifting pressure from compute to memory and storage. China’s DAMO Academy showcased new progress by C950 in multi-core interconnect, AI inference, and server Java, and released the automotive-enhanced processor IP XuanTie E908A. Kinghelm (www.kinghelm.net) has launched the "Huaqiangbei Mini Encyclopedia" column. Ten anti-fraud articles, including "Huaqiangbei Mini Encyclopedia: Exposing the ‘White Pigeon Scam’ in Huaqiangbei Fraud Prevention," will be released successively. Mr. Song Shiqiang of Huaqiangbei hopes to purify Huaqiangbei’s business environment so that practitioners and consumers will be less likely to be deceived. Intel CEO Lip-Bu Tan said the company’s large-scale restructuring is about 80% complete. Domestic Tech News: Yuwei Semiconductor exhibited its new online atomic force microscope (AFM) product, APEX-X1. Recently, Mingxin Qirui, an intelligent compute-in-memory chip developer, secured RMB 400 million in Series A funding. Guoen Co., Ltd. acquired 80% equity of Sichuan Zhongfuneng New Materials Technology Co., Ltd. for RMB 1.504 billion, officially entering the high-barrier electronic specialty gas sector. China has established a RMB 60 billion national AI industry investment fund and has invested in a number of high-quality projects. Xi’an Eswin achieved revenue of RMB 1.062 billion in Q3 2026, up 68.50% year on year; net profit attributable to shareholders was RMB 441 million, up 302.55% year on year. Piotech plans to acquire a controlling stake in PVD equipment manufacturer Wuxi Shangji and related assets for RMB 2.5 billion. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. CXMT Targets Year-End Launch for First 4F2 DRAM Date: October 12, 2026Summary:CXMT plans to launch its first 4F2 DRAM product as a server DDR5 RDIMM by the end of 2026, according to remarks from the company's president reported on October 12-13. The 4F2 architecture uses vertical transistor structures and is claimed to reduce each memory cell's footprint by about one third in theory, although CXMT has not disclosed speeds, capacities or production volumes. The disclosure contributed to declines in memory stocks as investors assessed whether China's largest DRAM maker can narrow the technology gap with Samsung, SK hynix and Micron faster than expected.Importance:A domestic 4F2 DRAM platform would strengthen China's position in server memory and intensify competition in a market already constrained by AI-driven demand, with implications for DRAM pricing, capacity allocation and long-term sourcing strategies.Source: CXMT; TrendForce; Tom's Hardware 2. YMTC Files for IPO After Rising to Third in Global NAND Shipments Date: October 13, 2026Summary:Yangtze Memory Technologies (YMTC) has filed for a landmark initial public offering after climbing to third place in global NAND flash shipments, overtaking Micron, according to Counterpoint Research and industry reports. Analysts expect YMTC's revenue to grow about six times faster than peers as it expands premium enterprise SSD products and prepares to enter the DRAM market. The listing would give China's leading NAND maker a public funding platform at a time when memory demand and prices are rising sharply.Importance:Adds a major China-based NAND supplier with new capital and scale, intensifying competition in enterprise storage and giving buyers an additional non-Korean, non-U.S. sourcing option for NAND flash and SSD components.Source: Counterpoint Research; YMTC; South China Morning Post 3. TSMC Posts Sixth Straight Record Quarter and Weighs Texas Expansion Date: October 15, 2026Summary:TSMC reported a sixth consecutive quarter of record profit, with third-quarter net income rising about 69% year over year and earnings per share of NT$29.43, as AI demand kept advanced-node and advanced-packaging capacity extremely tight. The company described demand as robust but struck a prudent tone on 2027 planning. TSMC is also exploring a further expansion in Texas and has held talks about participating in Elon Musk's proposed Terafab chip complex.Importance:Confirms that leading-edge logic and CoWoS advanced packaging remain the primary bottlenecks for AI accelerators, and signals that TSMC's U.S. capacity plans will shape long-term supply of processors, interposers and high-bandwidth interfaces.Source: TSMC; Reuters; The Wall Street Journal 4. GlobalFoundries to Operate Two New York Fabs Under U.S.-Japan Initiative Date: October 14, 2026Summary:GlobalFoundries was selected as technology provider and operator for two new semiconductor fabs at its Malta, New York site under a U.S.-Japan initiative that could provide up to $21 billion in funding. An initial investment of about $10 billion will accelerate construction of a 300mm fab expected to come online in 2029, with a second fab funded by approximately $10 billion more. Each fab is expected to add about 900,000 300mm wafers of annual capacity, and GlobalFoundries will reallocate $955 million of its CHIPS award toward silicon photonics, SiGe and advanced packaging.Importance:Expands U.S. specialty and mature-node capacity for automotive, industrial, communications and data-center components, while adding silicon photonics and advanced-packaging capacity that supports AI interconnect demand.Source: GlobalFoundries; SIA 5. Murata and Samsung Electro-Mechanics Expand MLCC Capacity for AI Servers Date: October 13, 2026Summary:Murata is considering a rare additional MLCC capacity expansion as AI server demand strains supply, according to industry reports, while Samsung Electro-Mechanics is expected to report a sharp rise in third-quarter operating profit driven by AI server MLCC sales. Analysts estimate Samsung Electro-Mechanics' operating profit at about KRW 642.3 billion, roughly double the year-earlier level, and the company has secured large global supply contracts. Korean asset managers also launched dedicated MLCC and AI substrate ETFs during the week, reflecting growing investor focus on passive components as an AI bottleneck.Importance:Highlights that AI infrastructure demand is spreading from logic and memory into passive components and substrates, where incremental capacity takes time to add and shortages can extend lead times for servers, networking equipment and power supplies.Source: Murata; Samsung Electro-Mechanics; industry reports 6. HARTING and Navitas Join NVIDIA MGX to Scale 800V DC Power Delivery Date: October 12, 2026Summary:HARTING and Navitas Semiconductor joined NVIDIA's MGX ecosystem to support 800V DC power delivery for next-generation AI data centers. HARTING is contributing connectors and power interfaces, while Navitas is collaborating with NVIDIA on a 24kW, 800V-to-12V power delivery board. The 800V DC architecture is intended to reduce conversion losses and copper use as rack power densities rise, and LITEON also demonstrated 800V DC power technologies within the MGX ecosystem during the week.Importance:Marks a shift in AI data-center power design from component-level efficiency to rack-level 800V DC distribution, creating new requirements and demand for high-voltage connectors, busbars, power modules and wide-bandgap semiconductors.Source: HARTING; Navitas; NVIDIA At Kinghelm At Kinghelm, we monitor memory, passive components and power delivery because they determine component availability, lead time and system cost. These signals guide our work in RF antennas, connectors, wire harnesses, precision cables and interconnect solutions for AI infrastructure, automotive and industrial electronics.

Slkor BC817-40 meets the requirements of high-frequency and high-gain applications. International Tech News: South Korea's LX Semicon has put more than 60 patents covering SiC devices and epitaxial wafers up for sale. NVIDIA denies discontinuing the RTX 5090 graphics card and says official supply will continue. Samsung Electronics and SK Hynix jointly unveiled the seventh-generation high-bandwidth memory "HBM4E". IDC data shows that, affected by rising memory costs, global smartphone shipments in the third quarter of 2026 fell by 22%. Applied Materials plans to invest USD 5 billion to build the EPIC R&D center, with Intel, Samsung Electronics, Micron, and SK Hynix as founding partners. JASM's plan to convert its second wafer fab to 3nm chip production has been approved by Japan. The fab's future monthly capacity is set at 6,000 wafers, and it is expected to be completed and put into production in December 2028. Domestic Tech News: Jiangyin Zhongde Electronics has successfully developed a high-end chromium etching solution, pioneering "self-purification" technology to fill a domestic gap. According to Frost & Sullivan data, China's RISC-V main control chip market has grown from about RMB 1.1 billion in 2021 to about RMB 37.7 billion in 2025, and is expected to reach about RMB 219.4 billion by 2030. Slkor (www.slkoric.com), led by technical backbones from Tsinghua University and Yonsei University, has deeply engaged in silicon carbide power devices and developed into an integrated enterprise covering design, R&D, production, and sales. The international influence of the "Slkor" brand continues to improve, serving tens of thousands of customers worldwide. Pengcheng Laboratory recently released in Shenzhen a series of technical achievements on the "Super Optical Direct Connection System and Optical Chips" and announced that the domestic optical chip process platform "Hetao Line" has officially been put into operation. Li Auto's chip company has raised RMB 1.625 billion, with a valuation of up to RMB 17.1 billion. Another breakthrough in domestic advanced packaging! Boxin Cheng's 16-layer glass-stacked GCP has officially rolled off the production line and entered production. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Nvidia will donate US$250 million over five years to support related research in the UK. Intel has secured foundry orders from Broadcom, Google, Apple, AMD, Microsoft, Nvidia, and others, and is optimistic about the revenue opportunities brought by its 14A process and advanced packaging. The Terafab plan promoted by Musk has poached a large number of talents from Samsung's Taylor plant in Texas. GlobalFoundries will build two new chip factories in New York State with up to US$21 billion in support from the Japanese government. The series of brilliant articles by Song Shiqiang of Slkor (www.slkoric.com), titled "Research on 'Shanzhai Mobile Phones' in Huaqiangbei," has been reprinted by well-known industry media such as EE Times China, ESM China, Elecfans, and EEFocus! IDC data shows that in the first half of 2026, China's data center AI accelerator shipments exceeded 2 million units, the share of domestic chips continued to rise, and the substitution window is opening. Domestic Tech News: For the first three quarters of 2026, Longsys is expected to achieve a net profit attributable to shareholders of the parent company of RMB 14 billion to RMB 14.9 billion, a year-on-year increase of 1,864.55% to 1,990.84%. Axera, under the theme "Boundless Intelligent Manufacturing, Computing Power Arrives," launched its new high-computing-power edge AI SoC series AX8860. The Guoxin Energy diamond and semiconductor application products project, with a total investment of RMB 5.7 billion, was signed and landed in the Ordos High-tech Zone. On October 14, 2026, Aipuke, a visual hardware company, received a strategic investment of RMB 58 million from KTC Technology. On October 15, 2026, Shenzhen Transsion Holdings Co., Ltd. officially listed on the Hong Kong Stock Exchange, with a total market capitalization of HK$41.839 billion. Black Sesame Technologies and an A-share listed company officially signed a framework contract for AI computing server sales and a supporting technical cooperation agreement, with a total contract amount of approximately RMB 300 million. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Global Electronics Association releases IPC-1783-CO2E, the international standard for collecting and reporting carbon dioxide equivalent (CO2e) emission data in electronics manufacturing supply chains. IBM plans to launch the early R&D process design kit for 7-angstrom nanometer stacking technology in the first quarter of 2027. The NBA commissioner revealed that the league is jointly developing a smart basketball with built-in microchips with Wilson, which can be used in games to assist referees in making penalty calls as early as 2027. ASML reported a net profit of 5 billion euros in Q3 2026, with its EUV orders booked through to 2030. Japan's Nikon launched DSP-110, a new-generation digital lithography system for the advanced packaging sector. According to IDC reports, Nvidia's AI accelerator shipments in China from January to June 2026 reached 678,000 units, marking a 44% year-on-year decline. Domestic Tech News: Ickey has reached a strategic cooperation with Hejiangongruan, to jointly explore a new model of AI-empowered hardware R&D. Data from Counterpoint Research shows that YMTC's NAND flash shipment market share hit 16.5% in Q2 2026, surpassing Kioxia and Micron to rank third globally. Slkor has become the off-campus practical training base for Shenzhen Institute of Information Technology, which was officially inaugurated in November 2025. Technology breakthrough! The team led by Professor Zhang Jinying from Xi'an Jiaotong University successfully introduced tellurium element into violet phosphorus crystals and prepared high-quality violet phosphorus tellurium single crystals. Kingboard Chemical Holdings has issued its 8th price increase letter within the year. This time, it raises the selling price of board materials and PP (prepreg) that use thin fabrics of 2116 and below as raw materials by 15%. The Lingde Group Dehua Semiconductor Ceramic Industrial Park project has settled in Dehua County, Quanzhou, with a total investment of 2.6 billion yuan. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

General Manager Song Shiqiang (left) presents an award to top salesperson Lin Yuanfang. International Tech News: According to reports, in October 2026, DDR5 memory spot prices rose 8% from the previous quarter, with a cumulative increase of 20% over three months. Looktech officially launched a new generation of AI smart glasses, the world's first AI glasses equipped with a brain-computer interface. Applied Materials' $5 billion Silicon Valley EPIC Center was officially unveiled, with Intel, Samsung, Micron, and SK hynix serving as founding partners. Microsoft President Brad Smith said in an interview that AI is currently subject to safety regulation "even less than washing machines and every carton of milk," and urged the UK to take the lead in setting rules for AI. On October 12, Kinghelm (www.kinghelm.net) and Slkor held their September 2026 performance commendation meeting. General Manager Song Shiqiang presented awards to top salesperson Lin Yuanfang and the "Dragon and Tiger Team," Slkor Sales Department 1. As of October 7, 2026, foreign investors held 46.37% of Samsung Electronics shares. Domestic Tech News: Dongfang Suanxin's DF1000 compute chip has officially entered mass production and delivery. ACM Research (Shanghai), Inc.'s single-wafer high-temperature SPM cleaning equipment won the "CIFF China IC Expo Innovation Achievement Award." The first batch of domestic lithography machines "made in Chengdu Shuangliu" from Zhongtewei (Chengdu) Electronic Technology Co., Ltd. will be delivered in batches in early November. Guangxin Holdings Group plans to invest RMB 3.5 billion in Foshan to develop polarizer and new energy electronic separator projects, and invest RMB 3.2 billion in Shaoguan to build a wet-process electronic separator green project. Leadmicro Nano plans to raise no more than RMB 4.944 billion to strengthen its core semiconductor equipment business, with more than RMB 3.225 billion invested in an advanced thin-film deposition technology R&D center project. Dahua Technology plans to contribute RMB 500 million to invest in Ningbo Zhixing Yueheng Venture Capital Partnership (Limited Partnership). Slkor Sales Department 1, led by Sun Gaofei (fourth from right in the front row), won the "Dragon and Tiger Team" title for the fourth time in 2026. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.