JLCPCB (001232) Successfully Lists Today International Tech News: 1. Japanese and South Korean leading manufacturers including Murata, Samsung Electro-Mechanics, and Taiyo Yuden have successively raised prices for high-end, high-capacitance MLCCs targeting AI servers and automotive applications, with price increases ranging from 15% to 30%. 2. It has been revealed that wafer price hikes in 2027 are a foregone conclusion, and OSAT suppliers have continued to raise prices throughout the second half of 2026. 3. Intel is accelerating the construction of its Ohio wafer fab project, with plans to achieve mass production of its 14A process technology by 2031. 4. London-based AI chip company OLIX has announced a $312 million funding round, valuing the company at $3.3 billion. 5. Kinghelm (www.kinghelm.net) brand's KH-series Beidou/GPS antennas and electrical signal connectors are best-selling products. Popular models include KH-TYPE-C-16P, KH-TYPE-C-2P, as well as SMA-series KH-SMA-K513-G and KH-SMA-KE-Z, MMCX-series KH-MMCX-Z, IPEX-series KH-IPEX-K501-29 and KH-IPEX4-2020, tactile switch series KH-6X6X5H-STM, KH-6X6X6H-STM, KH-6X6X9H-TJ, and KH-6X6X10H-TJ, HDMI-series KH-HDMI-19P-CU, and chip antenna series KH-3216-A35, among others. 6. In Q2 2026, global smartphone market revenue grew 7% year-over-year to $109 billion, reaching a record high for any second quarter. Domestic Tech News: 1. On August 4, JLCPCB (stock code: 001232) successfully went public, with an opening price of 234.35 yuan per share, representing a 177.47% increase. 2. The Kirin X90 Plus and Kirin XE90 chips were released. 3. ChangXin Memory Technologies, Inc. increased its registered capital from approximately 23.89 billion yuan to approximately 31.39 billion yuan, an increase of about 31%. 4. AMEC expects its net profit attributable to shareholders for the first half of 2026 to be between 2.7 billion and 2.9 billion yuan, representing a year-over-year growth of 282.48% to 310.81%. 5. Pinnacle Semiconductor officially unveiled its copper-interconnect full-through-package technology roadmap based on 8-inch SiC wafers. 6. The retail version of Liuxun's fully self-developed consumer-grade graphics card, the LX 7G100, is now officially on sale at Liuxun Technology's JD.com self-operated flagship store. Kinghelm board-to-board connectors Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor Low-Voltage N-Channel MOSFET BSS205N International Tech News: 1. Renesas Electronics plans to gradually shut down the Takasaki Factory of Renesas Semiconductor Manufacturing Co., Ltd., located in Takasaki City, Gunma Prefecture, Japan. 2. Samsung Electronics' trial production of 8-inch gallium nitride (GaN) wafers has encountered failures, and the mass production schedule originally set for completion within 2026 is highly likely to be postponed. 3. LG Display plans to invest 3 trillion Korean won in next-generation organic light-emitting diode (OLED) technology and production infrastructure. 4. South Korea's semiconductor exports surged 179% in July to $41 billion, exceeding the $40 billion mark for two consecutive months. 5. Quantum computing company IonQ acquires foundry SkyWater for $1.8 billion. 6. Apple's fiscal third-quarter revenue for fiscal year 2026 reached $109 billion, marking the fourth consecutive quarter with revenue exceeding $100 billion. Domestic Tech News: 1. A large-model team led by Professor Liu Houde from Tsinghua Shenzhen International Graduate School, with Postdoctoral Researcher Wang Libo serving as Chief AI Researcher, releases VeriLoop Coder-E1, an open-source domain-specific code model built on Qwen3.6-27B, designed for repository-level code repair and agentic software engineering tasks. 2. Data shows that from May to July 2026, nearly 10 major advanced packaging projects were rolled out in China, with total investment exceeding RMB 40 billion. 3. In July, Kinghelm (www.kinghelm.com.cn) achieved record-high sales, with the Kinghelm brand significantly enhancing its international influence and reputation; Song Shiqiang will award substantial bonuses to the team. 4. Huicheng Semiconductor's HITS advanced packaging industrialization project lands in Jiading, Shanghai, with a total investment of over RMB 7.5 billion. 5. Montage Technology globally launches trial production of the CXL 3.2 memory expansion controller (MXC) chip. 6. Official data shows that in the first half of 2026, China's integrated circuit design business revenue reached RMB 236.5 billion, a substantial year-on-year increase of 20.1%. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Kinghelm RJ45 Jack Connector KH-5224-8P8C-D International Tech News: 1.The 2026 Fortune Global 500 list has been released, featuring 122 Chinese enterprises, the second-largest number worldwide.2.Wafer foundry GlobalFoundries is expected to receive up to USD 300 million (approximately RMB 2.028 billion) in R&D subsidies to fully accelerate the research, development and mass production of next-generation silicon photonics technology.3.SpaceX, led by Elon Musk, has instructed its global supply chain partners not to hire or assign Chinese citizens to factories producing goods for SpaceX, nor to adopt systems or equipment manufactured by Chinese companies.4.TrendForce forecasts that manufacturers with independent control over silicon photonics design, optical engine production and advanced packaging resources will take a leading position during the volume growth phase of the CPO switch market from 2027 to 2028.5.On July 30, Wang Zhenxin, Supply Chain Manager of Kinghelm (www.kinghelm.net), delivered a company-wide training session on the Latest Standards for Material Coding at headquarters. Standardized material coding helps accelerate the enterprise’s digital transformation and upgrading.6.NVIDIA has raised graphics card prices by roughly 20% to 30% to cope with the continuous price hike of DRAM. Domestic Tech News: 1.The silicon-based gallium nitride (GaN) RF chips independently developed by No.55 Research Institute of China Electronics Technology Group Corporation have exceeded 5 million cumulative deliveries. This is the world’s first silicon-based GaN RF product to achieve large-scale commercial application in smart terminals.2.Zhongji Innolight, a global leader in high-speed optical modules, was officially listed on the Main Board of the Hong Kong Stock Exchange, completing its dual A-share and H-share listing layout.3.The South China Headquarters of Suzhou Xinhuilian Semiconductor Technology Co., Ltd. was officially put into operation at Wenhanhu International Science and Innovation Cooperation Zone in Guicheng, Foshan.4.The ultra-high-purity special gas equipment project of Zhengfan Technology in Taizhou, with a total investment of RMB 1.5 billion, has entered the final stage before official production.5.A third-generation semiconductor power device production project in Changzhou, Jiangsu, has completed filing procedures, with a total investment of RMB 980 million.6.Zhejiang Huachen Xinguang Technology Co., Ltd. closed a new round of financing worth over RMB 100 million. Kinghelm Wire-to-Board Connectors Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

SLKOR BFG520/XR is used in various electronic circuits. International Tech News: 1. Market sources indicate that NVIDIA's first batch of GB300 AI GPUs, built on the Blackwell architecture, has recently completed production and rolled off the assembly lines at foundries.2. According to Counterpoint Research data, smartphone memory prices grew by over 80% quarter-on-quarter in the second quarter of 2026, leading to a significant increase in BOM (Bill of Materials) costs for models across all price segments.3. Samsung Electro-Mechanics and Soulbrain will jointly tackle the development of key chemicals required for the mass production of next-generation advanced packaging glass substrates.4. Meta and BlackRock will invest $14 billion to build an El Paso data center in Texas.5. SK Hynix plans to begin mass production and shipment of its next-generation low-power mobile DRAM product, LPDDR6, in the second half of 2026, and will initially supply it to Xiaomi for use in smartphone products.6. Japanese media reported that an earthquake in Kumamoto Prefecture, Japan, on July 28 affected multiple semiconductor manufacturers, with some companies currently suspending operations. Domestic Tech News: 1. Basic Semiconductor will build a silicon carbide (SiC) module packaging production line base in Pingshan District, Shenzhen, with an intended investment of RMB 193.3 million.2. Dacai Optoelectronics' Western Super Factory has been fully completed and is scheduled to commence production on August 1.3. SLKOR (www.slkormicro.com) and Kinghelm's official websites are undergoing a meticulous revamp to optimize interfaces and column categories, which will bring users a clearer and smoother browsing experience.4. Shenzhen Aixi Semiconductor has completed a nearly RMB 1 billion Series B+ financing round, with investors including China Reform Fund, Shenzhen Kunpeng Capital, and others.5. Chipone Technology's first self-developed OLED display touch and display integrated (TDDI) chip, the ICNA3611, has achieved commercial mass production.6. Suzhou Jingxi Semiconductor plans to invest RMB 630 million to build an industrialization project for advanced semiconductor wafer laser stealth dicing technology. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Kinghelm KH-RCH56-8P8C-D Industrial-Grade RJ45 Connector International Tech News: 1.Samsung Electronics and SK have signed an AI semiconductor and infrastructure cooperation agreement with a total scale of up to 950 billion US dollars. 2.Samsung Electro-Mechanics will raise prices of its Multi-Layer Ceramic Capacitor (MLCC) products by 30%, effective August 1, 2026. 3.The 28th China International Software Expo and Intelligent Agent Innovation Application Conference (abbreviated as the "Soft Expo") will be held from September 20-22, 2026, at the Zhengzhou International Convention and Exhibition Center. 4.China has begun independently developing immersion deep ultraviolet (DUV) lithography machines. 5.Kinghelm (www.kinghelm.com.cn) offers popular RF connecting cables such as KHB80-37(11)-28, KHB(RG113)-100-29, KH-IPEX-SMAKWE-Q80H, KHA(RG1.37)-TX100B-IPEX, and KH-IPEXA-SMAKWE-B050H. 6.German automaker Porsche plans to cut about one-fifth of its workforce by 2035, totaling 9,000 jobs. Domestic Tech News: 1.The SST China 2026 China Solid-State Transformer Technology and Application Ecology Conference will be held on August 6-7 at the Tongli Lake Hotel in Suzhou. 2.According to the "National Informatization Development Report (2025)", the added value of China's core digital economy industries accounted for over 10.5% of GDP in 2025, with the digital industry's revenue reaching 39.6 trillion yuan, a year-on-year increase of 8.8%. 3.A specialty power semiconductor chip production line project, with a total investment of 3 billion yuan, has been signed and settled in Tianning District, Changzhou City. 4.Tongfu Microelectronics (Shenzhen) Co., Ltd. has been established, with a registered capital of up to 1 billion yuan. 5.Suxian Microelectronics has released the Thor Unified Computing Architecture for next-generation AI and heterogeneous computing, as well as the "Tianheng 1100" GPGPU processor for AI scenarios such as embodied intelligence. 6.Among the top 6 domestic mobile phone manufacturers, several have explicitly rejected memory suppliers' requests for price increases in the coming quarters. Kinghelm RF Connecting Cable Classification Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Song Shiqiang visited OPPO's factory in Wusha, Chang'an, in 2017 International Tech News: 1. Samsung Electronics and SK Group announced that over the next five years they will collaborate with global technology partners on artificial intelligence semiconductor and infrastructure projects totaling $950 billion.2. A joint research team from Seoul National University and the University of Seoul has developed a programmable photonic integrated circuit.3. SK Telecom will adopt NVIDIA’s Vera Rubin chips and SK Hynix’s HBM4 memory to build a 2-gigawatt (GW) AI data center, with the first facility scheduled to go online in 2027.4. Delta Electronics and Infineon have signed a long-term supply agreement for silicon carbide (SiC) worth up to $2 billion.5. AMD is partnering with the South Korean government to establish an AI research center in Korea and build an open AI infrastructure ecosystem.6. Reports indicate that NVIDIA GPUs have recently seen another price increase of 20%–30%, marking the third price hike this year after those in January and May. Domestic Tech News: 1. Shengyi Technology's AI high-performance computing and advanced semiconductor substrate R&D and manufacturing base project has landed in Suzhou, with a total investment of approximately ¥5 billion.2. On July 27, Changxin Memory Technologies surged 530% at the opening bell, reaching a total market capitalization of about ¥3.66 trillion.3. Mr. Song Shiqiang of Slkor (www.slkormicro.com) will soon publish A Study on Shanzhai Mobile Phones in Huaqiangbei (Part II). To objectively and accurately document the history of "Huaqiangbei shanzhai phones," Mr. Song began collecting industry materials early on. In 2014, he visited the factory of OTOT Group in Xixiang’s Ninth Industrial Zone; in 2015, he inspected ZTE’s subsidiary Zhongxing Xingyida Company in Bao’an District’s Xinyongfeng Industrial Park, specifically inquiring about their mobile phone supply chain management; and in 2017, he toured OPPO’s factory in Wusha, Chang’an, Dongguan, where he observed their production lines.4. Wang Xingxing, founder of Unitree Robotics, and the mass-production manned mecha GD01 appeared on the cover of TIME magazine, with the theme "The Age of Robots Is Here."5. Haichuan Intelligent released an acquisition plan to take a stake in Nanjing Jiyi Semiconductor Technology Co., Ltd., formally pivoting into the indium phosphide sector.6. BOE's project "Empowering High-Value Scenarios in New Display AI Factories Based on the Blue Whale Display Large Model" was successfully selected for the WAIC Collection of High-Value AI Application Case Studies. BAV70T is used in Bluetooth modules, smartwatches, and other miniaturized digital products Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. Changxin Memory Technologies (CXMT) currently ranks fourth in the global DRAM market, trailing Micron Technology, SK Hynix, and Samsung.2. NVIDIA's GB300 AI chip has been officially unveiled.3. According to Yole, the advanced packaging market reached $55 billion in 2025 and is projected to exceed $120 billion by 2031.4. IDC forecasts that global AI server shipments may surpass 2 million units in 2026, representing a year-on-year increase of up to 55%.5. On July 25, Slkor (www.slkoric.com) held its "Integrity Sustains Ambition, Chips Power the Future" summer team-building event in Laohugou. Activities including tug-of-war, off-road ATV rides, and an outdoor barbecue feast enabled all participants to enjoy themselves while strengthening team cohesion and solidarity.6. China's Innoscience has launched an all-GaN 12kW 800V-to-50V HVDC power supply solution for data centers. Domestic Tech News: 1. The 2026 Fortune China 500 list has been released, with 25 semiconductor and electronic component companies including SMIC, NAURA Technology, and Tongfu Microelectronics making the ranking.2. Xiaomi has raised its 2026 smartphone shipment target from approximately 90 million units to 110 million units.3. Nasen Intelligent Technology (Zhejiang) Co., Ltd. has passed the IPO hearing on the Hong Kong Stock Exchange (HKEX).4. Mass-production servers equipped with the LX500 — a RISC-V + AI intelligent-convergence chip developed by Lanxin Computing — have officially rolled off the production line at Lenovo's LCFC factory in Hefei.5. Unigroup Guoxin Microelectronics plans to establish its power semiconductor business as one of its core operating segments and key industrial pillars.6. Qiyuan Xinchuang, a wholly-owned subsidiary of Shangwei New Materials, has officially signed an agreement to settle in the Zhangjiang Robotics Valley in Pudong, Shanghai, as a key municipal artificial intelligence project. Slkor Summer Team Building in Laohugou Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. Japanese storage giant Kioxia has been found guilty of patent infringement and ordered to pay satellite communications company Viasat $229 million (approximately RMB 1.55 billion). 2. Intel will invest 5 billion euros to further expand the Intel 3 process capacity at its Fab 34 facility in Ireland. 3. OpenAI has partnered with Broadcom to launch Jalapeño, an inference chip specifically designed for large language models (LLMs). 4. The size of China's semiconductor memory market is expected to reach $449.6 billion in 2026, with a projected market growth rate of 262.9%. 5. Kinghelm's (www.kinghelm.com.cn) built-in antennas are key components adapted for miniaturized and portable electronic devices (such as mobile phones, laptops, IoT sensors, etc.). Among them, built-in ceramic antennas are divided into block ceramic antennas and multi-layer ceramic antennas (LTCC, Low-Temperature Co-fired Ceramic antennas). They are often used as dedicated antennas for narrow-band communications like GPS and Bluetooth, and due to their size advantages, they enable a "stealth" (invisible) layout within the device. 6. China's industrial robot density has surpassed that of Germany and Japan, ranking among the top globally. Domestic Tech News: 1. Iluvatar CoreX officially releases its next-generation flagship general-purpose GPU, the Tiangai 300. 2. From September 1, 2026, to December 31, 2028, sodium-ion batteries, solid-state batteries, fuel cells, and others in China are fully exempt from consumption tax. 3. Arm Technology (China) Co., Ltd. officially launches the "Open Source AIOS Alliance," which has already attracted over 20 ecosystem partners. 4. The 2026 China Optoelectronics Integration Technology Industry Conference will be held on November 10-11 in Suzhou, Jiangsu. 5. The research team from Fudan University has published their technological achievement, "Quantum Flash," in the journal Science. 6. Tongfu Microelectronics (TFME) expects to achieve a net profit attributable to parent company shareholders of RMB 1.6 billion to RMB 1.8 billion in the first half of 2026. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. A South Korean research team has successfully developed a novel two-dimensional semiconductor structure, enabling unimpeded current flow. 2. Japan plans to purchase 27,500 units of NVIDIA's next-generation Rubin chips to build its self-developed foundational artificial intelligence model for robotics. 3. The European Union has approved Germany's provision of 659 million euros in state subsidies to fund four European "first-of-their-kind" semiconductor factories in Germany. 4. Nokia and NVIDIA have jointly launched the first commercial AI-driven Radio Access Network (RAN) platform, with NVIDIA simultaneously acquiring a stake in Nokia. 5. SK Hynix has commenced mass production and shipments of its 12-layer HBM4, with the product now entering the capacity ramping-up phase. 6. Due to global aging populations and declining birth rates, TrendForce predicts that the humanoid companion robot market will reach $1.1 billion by 2030. Domestic Tech News: 1. In the first half of this year, the integrated circuit output of industrial enterprises above a designated size in China reached 279.8 billion units, averaging over 1.5 billion units produced per day. 2. It is reported that ByteDance, in collaboration with ZTE Nubia, will launch multiple models of its first AI agent smartphone (the "Doubao AI Agent Smartphone") this year. 3. The 2026 Shenzhen Sichuan-Chongqing Basketball Tournament is about to begin. Song Shiqiang of Kinghelm Electronics and Slkor (www.slkormicro.com) wishes the 2026 Shenzhen Sichuan-Chongqing Basketball League a complete success! 4. MeiKeShenSi, Biren Technology, and JieYue have joined forces to build a photoelectric-integrated AI computing infrastructure. 5. The 2026 Bay Area Semiconductor Industry Ecosystem Expo (referred to as the "Wanxin Expo") will be held from October 14 to 16 at the Shenzhen Convention and Exhibition Center (Futian). 6. XinYueNeng and XinJuNeng have successfully completed an equity financing round of over 700 million yuan. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. Chinese AI company DeepSeek has begun preparations for an initial public offering (IPO).2. Intel has decided to adopt ASML's next-generation High-NA EUV lithography systems for the production of certain flagship Panther Lake laptop processors.3. Researchers from the Korea Institute of Industrial Technology and Pohang University of Science and Technology have developed a new process that enables the stable stacking of more than ten ultra-thin semiconductor chips.4. Samsung Electronics has completed the tape-out of Tesla's next-generation AI chip, AI5.5. Mr. Qin Xianghong, Chief Engineer of Kinghelm (www.kinghelm.net), has revealed that Kinghelm is about to launch products for satellite communications and optical communications. This initiative, which has been in preparation for several years with accumulated talent and technology reserves, is in line with Kinghelm's nearly two decades of deep expertise in microwave RF technology and products such as Beidou antenna signal connectors.6. The global satellite direct-to-device (D2D) market is rapidly transitioning from the "technology validation" and "business model exploration" phases into the deep-water zone of "large-scale commercial competition" and "diverging technology roadmaps." Domestic Tech News: 1. In the first half of 2026, the integrated circuit output of China's industrial enterprises above designated size reached 279.8 billion units, equivalent to an average daily production of over 1.5 billion integrated circuits.2. Yunbao Intelligence has submitted its GEM IPO materials to the Shenzhen Stock Exchange, positioning itself as the "first domestic DPU stock."3. FaceMagic Intelligence secured over RMB 5 billion in cumulative financing in the first half of 2026, with a valuation exceeding RMB 20 billion.4. BYD Semiconductor's self-developed automotive-grade BMS AFE (battery management analog front-end) chips have achieved cumulative shipments exceeding 100 million units.5. Shanghai Zhenglong Xinchuang Microelectronics Co., Ltd. plans to invest RMB 7.5 billion in the "HITS Advanced Packaging R&D and Industrialization Project."6. Black Sesame Intelligence has completed the acquisition of Zhuhai YiZhi Electronics. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. Samsung Electronics and Samsung Display are jointly advancing the R&D of next-generation glass interposer technology, with sample prototyping expected to be completed as early as 2026.2. Intel will invest an additional €5 billion in its Irish plant to comprehensively expand chip production capacity.3. Tata Consultancy Services (TCS) of India plans to build an AI engineer team of nearly 9,000 people and is seeking acquisition opportunities in the artificial intelligence field.4. Tesla's in-vehicle chip AI5 has completed tape-out, and the project has now entered the preliminary preparation stage for mass production.5. FORVIA Hella's first headlamp controller (ECU) fully using locally sourced chips has gone into mass production in China.6. Tower Semiconductor plans to invest approximately $3 billion to expand its 300-mm silicon photonics device production capacity and advanced packaging capabilities in Japan. Domestic Tech News: 1. Swancor Advanced Materials has launched its new consumer-grade embodied intelligence brand, Qiyuan Robot, with the new product – Qiyuan T1 (Transformer 1).2. Hubei Xingchen completed a Series A financing round of over RMB 4 billion, setting the record for the largest single financing in China's advanced packaging sector in 2026.3. Slkor (www.slkormicro.com) and Kinghelm (www.kinghelm.net) regularly hold new-employee examinations covering corporate culture, product knowledge, and company regulations, helping newcomers deeply understand the company's mission and values while enhancing team belonging.4. Basic Semiconductor announced that from the third quarter of 2026, prices for some products will be raised by up to 25%.5. SiEn Integration's 12-inch automotive-grade mixed-signal chip manufacturing project has broken ground, with a total investment of approximately RMB 20 billion.6. According to a TrendForce report, driven by sustained demand for SLC NAND from data centers and automotive electronics, contract prices for SLC NAND in the second half of 2026 are estimated to rise by 120-170% compared to the first half. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. The research team at the Xi'an Institute of Optics and Precision Mechanics (XIOPM), Chinese Academy of Sciences, has developed a novel "optical needle," with the results published in the international journal Nanophotonics. 2. The global semiconductor device industry's total revenue is projected to reach USD 1.6 trillion in 2026, and is expected to exceed the USD 2 trillion mark in 2027. 3. Samsung Electronics has raised its foundry prices for 4nm, 5nm, and certain automotive 8nm nodes by approximately 15%. 4. UBS estimates that the global memory industry revenue will reach USD 992 billion in 2026, and will surge to about USD 1.76 trillion in 2027. 5. Song Shiqiang on Wisdom – A Collection of Dialogues from the 2026 Shanghai Munich Electronica Show has been officially released. During the exhibition, Mr. Song Shiqiang, General Manager of Kinghelm (www.kinghelm.net) and Slkor (www.slkoric.com) and a prominent opinion leader of Huaqiangbei, appeared successively in the "Executive Dialogue" livestream with EEFocus, participated in interviews and livestreams with Zhixin Suge's "GESA Chip Shines East," and took part in a special written interview with HC Electroincs Network, driving strong brand exposure and deep embedding for the "Kinghelm" and "Slkor" brands. 6. AMD will launch its highly anticipated EPYC Venice server CPU based on the all-new Zen 6 architecture at the Advancing AI 2026 conference on July 22–23. Domestic Tech News: 1. China Resources Microelectronics, Silan Microelectronics, Nexperia, BYD Semiconductor, and CRRC have made it into the global top 20 power semiconductor manufacturers by sales revenue in 2025. 2. Oriental Core Computing has officially launched the DF1000, the world's first AI chip based on the "software-defined chip" and "near-memory computing" technological architectures. 3. The second-phase construction of the Chiayi Science Park has officially commenced, with its positioning aimed at creating a semiconductor industry cluster centered on advanced packaging. 4. Piotech has proposed to acquire a controlling stake in Wuxi Shangji Semiconductor Technology Co., Ltd. 5. The Furuide Wuhan Precision Cleaning & Regeneration Service Base project has commenced construction, with a total investment of RMB 203 million. 6.Mr. Shi Lei, Chairman and President of Tongfu Microelectronics Group, has been awarded the lifelong title of Dato' (Darjah Johan Negeri) by the state of Penang, Malaysia. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: China has announced the temporary imposition of export controls on helium, an irreplaceable core material in semiconductor manufacturing. Micron Technology projects that its cumulative capital expenditures will exceed $250 billion (approximately RMB 1.82 trillion) by 2035. Analog Devices, Inc. (ADI) has fully acquired Empower Semiconductor, a high-performance power management company. SK Hynix has raised $26.5 billion through the issuance of 177.9 million depositary shares (ADSs, at $149 per share). Recently, Kinghelm (www.kinghelm.net) has seen a surge of bestselling products on LCSC, including KH-IPEX-K501-29, KH-TYPE-C-16P, KH-6X6X5H-STM, KH-SMA-K513-G, KH-SMA-KE-Z, KH-CR1220-2, and KH-BNC50-3511. General Manager Song Shiqiang stated that Kinghelm consistently balances technology, cost, management, efficiency, and sustainable development, and is dedicated to providing customers with high-performance, high-reliability products and services. The global semiconductor packaging and testing market is expected to expand to $134.9 billion by 2029, with a compound annual growth rate (CAGR) of 5.9% from 2024 to 2029. Domestic Tech News: The core node of the National Supercomputing Internet has officially been put into operation, marking the country's first 100,000-card-level super-fusion computing resource pool integrating supercomputing and AI. GigaDevice (603986.SH) expects its revenue for the first half of 2026 to reach approximately RMB 11.5 billion, an increase of about 177% year-on-year; net profit is expected to be around RMB 6.9 billion, an increase of about 1,099% year-on-year. The world's first 8-inch two-dimensional semiconductor pilot line, developed by former JiMicro, has been officially launched. General artificial intelligence company MiniMax has completed a new financing round totaling HK$16 billion. Tencent is in negotiations to acquire a stake in AI agent startup Manus and is expected to become its largest shareholder. Nexchip Semiconductor Corporation‌ (02249.HK) has successfully gone public, with a total market capitalization exceeding HK$81.7 billion (approximately RMB 70.8 billion). Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Samsung Electronics has begun mass production of the PM1763 storage drive, which will be incorporated into NVIDIA’s Vera Rubin platform. According to sources, Mitsubishi Chemical and Japan Steel Works plan to increase their gallium nitride (GaN) production capacity by 50%. SEMI and TechSearch International jointly released the 2026 edition of the Global Assembly & Test Facility Database, covering over 820 assembly and test facilities worldwide. Meta expects to start mass production of its in-house AI chip, codenamed "Iris," in September, and plans to raise its total computing power to 14 GW next year. TrendForce estimates that server DRAM contract prices will rise by 13–18% quarter-over-quarter in the third quarter. Synopsys plans to discontinue sales of certain wafer-fab manufacturing analytics software, reallocating resources toward higher-margin businesses such as AI chip design. Domestic Tech News: Omdia’s latest research shows that due to sustained significant increases in storage costs, the global market for smartphones priced below $400 is expected to decline by 22% this year. BOE estimates its net profit for the first half of 2026 at RMB 5.00–5.50 billion, representing a year-on-year increase of 54–69%. See You Next Year | A Review of Slkor’s Highlights at electronica China 2026 (slkormicro.com) was featured as the lead article in the "Chip News Headlines" column on Huicong Electronics Network. GRINM Semiconductor plans to acquire 60% of the equity of Anhui Jinglong Semiconductor Technology Co., Ltd. for RMB 451 million. SMIC’s market capitalization surpassed that of Kweichow Moutai, reaching RMB 1.49 trillion. Oriental Semiconductor plans to raise up to RMB 1.436 billion through a private placement, to be invested in new power devices, next-generation control chips, and R&D center construction. Slkor Article Tops "Chip News Headlines" Column on Huicong Electronics Network Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Chinese enterprise Eacon Auto was listed on the Hong Kong Stock Exchange, with a total market capitalization of HK$14.24 billion. Corning Incorporated introduced "Glass Bridge," a glass-based optical interconnect technology for next-generation AI data center architectures. Samsung Electronics has postponed the mass production plan for its CXL 3.1-based memory module (CMM-D 3.0). Dutch semiconductor equipment startup Nearfield Instruments completed a $380 million Series D financing round and plans to launch an initial public offering in 2028. Slkor Semiconductor (slkormicro.com) plans to open its third Slkor specialty store in the Huaqiangbei commercial district, with headquarters providing brand authorization, design and decoration, staff training, advertising and promotion, supply chain support, and company stock options as substantial benefits. Interested parties may contact Mr. Qiu at 186 8898 5346. Leading large-model AI firm Anthropic has an annualized revenue run rate (ARR) of approximately $47 billion, while OpenAI's ARR is about $30 billion. Domestic Tech News: The 2025 National Science and Technology Awards have been announced, with the State Preeminent Science and Technology Award going to Academician Chen Liquan of the Institute of Physics, Chinese Academy of Sciences, and Academician Ben De of China Electronics Technology Group Corporation. Shenzhen Basic Semiconductor Co., Ltd. was listed on the main board of the Hong Kong Stock Exchange under stock code 09971. Changxin Memory Technologies officially launched its IPO process on the STAR Market, and both the online and offline subscriptions will take place on July 16, 2026. Guangliwei has built a full-chain self-developed technology matrix to solidify the yield foundation for large-scale production of domestic 3D ICs. Huake Lengxin (Wuhan) Power Technology Co., Ltd. is building a central R&D headquarters in Donghu Wanggu, focusing on product innovation and technological breakthroughs in liquid cooling thermal management. Xiaomi Auto unveiled its new brand "SkyNomad" (Chinese name "寻天"), officially describing it as "a new name for space and living." Kinghelm Product Classification Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Broadcom and Apple renewed a multi‑year agreement, extending the custom ASIC chip contract to 2031. Reports indicate that Intel plans to introduce an improved process node called 14A2 (i.e., 14A Gen2) based on its standard 14A process. LG Innotek plans to build its US$1 billion semiconductor substrate packaging plant in Vietnam in the third quarter of 2026. Samsung Electronics reported an operating profit of 89.40 trillion Korean won in the second quarter of 2026, a year‑on‑year increase of 1,810%. Japan’s Sumitomo Electric will expand production capacity for indium phosphide (InP) substrates used in optical communications materials, targeting a capacity 3.1 times that of fiscal 2024. Microsoft announced layoffs of 4,800 employees, with 3,200 from its Xbox division. Domestic Tech News: According to Omdia’s forecast report, China’s semiconductor market will exceed US$812.9 billion in 2026, with the memory market expected to reach US$449.6 billion, a surge of 262.9%! BYD Semiconductor’s battery management analog front‑end (BMS AFE) chips have cumulatively shipped over 100 million units. Slkor (www.slkoric.com) products sold nearly 2,000 orders on the Digi‑Key platform in June, maintaining a monthly growth rate of over 10%. Song Shiqiang stated that after years of efforts, the internationalization of the Slkor and Kinghelm brands has begun to show initial results! Hangzhou Yuzhiquan, in collaboration with Zhejiang University’s National Key Laboratory of Extreme Optical Technology and Instrumentation, officially launched a 10,000‑channel 3D nano laser direct writing lithography machine. Zhonghao Xinying released its new generation of fully self‑developed high‑performance TPU AI‑specific chip named "Xuyu". According to Sigmaintell data, as of May, sales of OLED gaming laptops in China increased by 507% year‑on‑year. Slkor's shipment volume trend chart on the Digi‑Key platform Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Micron Technology held a groundbreaking ceremony for the expansion of its Hiroshima plant in Japan, with an investment of 1.5 trillion yen ($9.3 billion). DMS, a Korean display and semiconductor equipment manufacturer, has signed a display equipment supply contract with Chinese display panel maker HKC (HKC Corporation) worth 41.3 billion won (approximately 183 million RMB). Samsung Electro-Mechanics will invest a total of approximately 15 trillion won over the next several years, focusing on its two core production bases in Busan and Sejong. SK Hynix plans to invest 600 trillion won by 2033 to build the Yongin semiconductor cluster. From July 1 to 3, Kinghelm (www.kinghelm.net) and Slkor (www.kinghelm.net) once again appeared as exhibitors at electronica China 2026, at booth W5.317. The 2026 electronica Shanghai, held over three days at the Shanghai New International Expo Centre in Halls W1–W5 and N1–N5, covered an area of 120,000 square metres and brought together over 2,000 quality exhibitors from home and abroad, spanning cutting‑edge fields such as semiconductors, antennas and connectors, embedded systems, sensors, and automotive electronics. CG Power & Industrial Solutions Ltd. in India has begun production at its new semiconductor factory, with an annual production capacity of 200 million chips. Domestic Tech News: Zhaorui New Energy has officially started large-scale batch delivery of its self-developed 170 Ah sodium-ion battery cells and has landed a megawatt-level energy storage project in Tibet. Changxin Memory Technologies' high-speed DDR5 memory modules have passed MSI's official compatibility verification. Office equipment manufacturer Deli has launched multiple printers, Xinchuang desktops, and notebooks, all of which are powered by Loongson Technology's self-developed chips. Primarius Technologies (Shanghai) Co., Ltd. plans to acquire assets to bridge the synergy between EDA and IP. Suzhou Shijunxin Microelectronics Co., Ltd. has successfully delivered its first semiconductor-grade CVS (cyclic voltammetry stripping) plating-solution on-line inspection and additive analyser to a leading Chinese advanced packaging company. According to incomplete statistics, there are currently 62 semiconductor companies queuing for IPO review on the A-share market, with total planned fundraising amounting to 146.4 billion yuan. Mr. Song Shiqiang (left) during the interview Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: According to reports from South Korean media, after Samsung Electronics raised DRAM prices by 90% in the first quarter and 60% in the second quarter, the company plans to further increase prices by 20% in the third quarter. Microsoft plans to invest US$2.5 billion and assign 6,000 employees to establish a new artificial intelligence implementation division. Google's next-generation Tensor Processing Unit (TPU) advanced packaging will adopt Intel's EMIB-T packaging technology. Kioxia of Japan will begin mass production of the 10th-generation BiCS flash memory, jointly developed with SanDisk, at its Kitakami plant in Iwate Prefecture. India's Semiconductor Program 2.0 has been launched, with a planned investment of INR 1.25 trillion (approximately US$13 billion). Micron Technology will invest JPY 1.5 trillion to expand its Hiroshima facility in western Japan, which will focus on the mass production of advanced memory chips such as High Bandwidth Memory (HBM). Domestic Tech News: Hangzhou Garene Semiconductor's first mass-production line for gallium oxide homoepitaxial wafers, compatible with both 6-inch and 8-inch substrates, has officially commenced operation. Longsys Electronics expects its revenue for the first half of 2026 to reach RMB 22.0 billion to RMB 25.0 billion, representing a year-on-year increase of 115.8% to 145.2%; net profit is expected to reach RMB 9.2 billion to RMB 11.0 billion, representing a year-on-year increase of 62,200% to 74,390%. Masanori Tozawa, President of Japan's Corestaff Co., Ltd., visited the Kinghelm/Slkor booth (www.slkoric.com) at electronica China in Shanghai, where he and Mr. Song Shiqiang discussed future cooperation plans. Shenzhen Zhifang has completed a new round of financing totaling nearly RMB 5 billion, bringing the company's valuation to over RMB 20 billion. Chinese inventors Yu Haijun and Xie Yinghao have won the 2026 European Inventor Award for their inventions related to intelligent battery recycling. Unicomp Technology plans to invest RMB 600 million to establish its South China headquarters base for industrial inspection equipment. Group Photo of Mr. Song Shiqiang (Second from Left) and His Team with Mr. Masanori Tozawa Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. Semiconductor Selloff Hits Global Markets as AI Spending Concerns Mount Date: June 23, 2026Summary:Global semiconductor stocks experienced a sharp selloff as concerns over AI capital expenditure intensified. The Philadelphia Semiconductor Index dropped nearly 8% in a single session, with major players such as Nvidia, AMD, Intel, and Micron falling between 5% and 10%. Investors are increasingly questioning whether hyperscaler AI infrastructure spending is becoming unsustainable.Importance:Signals a shift in the AI semiconductor cycle from "growth-driven expansion" to "profitability validation," increasing market volatility across chip equities.Source: Reuters 2. EU Approves €76 Million Aid for Advanced Semiconductor Facility in Germany Date: June 23, 2026Summary:The European Commission approved €76 million in state aid for QuantumDiamonds GmbH to build an advanced semiconductor testing facility in Munich, Germany. The initiative will support collaboration between universities and SMEs to strengthen Europe’s capabilities in AI chip testing and cloud computing infrastructure.Importance:Strengthens the EU’s semiconductor sovereignty strategy and reduces dependency on U.S. technology ecosystems.Source: Reuters 3. OpenAI Launches First Custom AI Inference Chip with Broadcom Date: June 24, 2026Summary:OpenAI, in collaboration with Broadcom, unveiled its first custom AI inference chip codenamed "Jalapeño." The chip is optimized for large-scale AI inference workloads and demonstrates significantly improved energy efficiency compared to traditional GPU-based solutions.Importance:Marks a major shift toward vertical integration in AI infrastructure, as AI companies begin developing in-house silicon to reduce reliance on Nvidia GPUs.Source: TechCrunch 4. Micron and Qualcomm Forecasts Ignite Massive AI Chip Rally Date: June 24, 2026Summary:Strong forward guidance from Micron and Qualcomm triggered a massive rally in AI semiconductor stocks, adding over $400 billion in combined market value. Micron highlighted sustained demand growth in HBM and DRAM driven by AI workloads.Importance:Reinforces the long-term demand cycle for memory and connectivity chips as AI infrastructure continues to expand rapidly.Source: Investing.com 5. Qualcomm Expands Into Data Center AI Chips, Wins Microsoft and Meta Orders Date: June 24, 2026Summary:Qualcomm announced its new AI data center chips have been adopted by Microsoft and Meta, with additional custom deployments expected across hyperscale customers. The architecture focuses on cost efficiency and alternative memory designs to compete with Nvidia’s GPU ecosystem.Importance:Highlights intensifying competition in AI compute, shifting the industry toward heterogeneous architectures (GPU, ASIC, CPU hybrid models).Source: Investing.com 6. Japan Announces $640 Billion National AI and Semiconductor Investment Plan Date: June 27, 2026Summary:Japan unveiled a long-term industrial strategy allocating approximately $640 billion toward AI and semiconductor development, including advanced manufacturing, data centers, and next-generation communication systems. The goal is to significantly expand Japan’s domestic chip ecosystem by 2040.Importance:Represents one of the largest national semiconductor investment programs, reshaping global supply chain competition and regional manufacturing capacity.Source: Reddit At Kinghelm At Kinghelm, we closely monitor global trends in semiconductor process nodes, AI infrastructure growth, and advanced packaging technologies. These developments help guide our innovation in RF antennas, connectors, wire harnesses, precision cables, and interconnect solutions for next-generation electronics. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

International Tech News: IBM has introduced the world’s first sub-1-nanometer chip process technology, with a 70% improvement in energy efficiency compared to its 2nm node chips. Samsung plans to invest 1,000 trillion KRW in South Korea, focusing on artificial intelligence and semiconductors. Micron Technology reported revenue of $41.456 billion for fiscal Q3 2026, up 345% year-over-year. Corning has launched its next-generation glass optical interconnect component, "Glass Bridge," a glass-based optical connector that directly links photonic integrated circuits (PICs) with optical fibers. Due to a sharp rise in memory chip prices, Apple announced on June 25 that it will increase prices for Mac, iPad, and smart home devices, with increases generally ranging from 15% to 25%. A ceramic substrate project invested by a South Korean semiconductor company, with a total investment exceeding 10 billion RMB, has started construction in Guangzhou. Domestic Tech News: Changdian Technology plans to invest 7.8 billion RMB in the "Eastern Chip Port" Wanxiang Industrial Park in Shanghai Lingang to build an advanced high-end packaging and testing factory. According to the Hurun Research Institute’s 2026 Global Unicorn List, Anthropic, OpenAI, and ByteDance rank among the top three global unicorns. Slkor (slkoric.com) and Kinghelm will participate in the Munich Shanghai Electronics Fair from July 1 to July 3, 2026, at booth W5.317, welcoming global customers and industry partners to visit and discuss cooperation. Huachen Xingguang has launched its new Nova series product — an SHP ultra-high-power single-mode 980nm pump laser chip, expected to begin mass production in Q3. Yongsi Electronics plans to invest 10.3 billion RMB in a high-end integrated circuit IC packaging and testing project. HYCET (a semiconductor display company) has been listed on the Shenzhen Stock Exchange main board, with a total market capitalization exceeding 350 billion RMB. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.