A7/M7/FR107/1N4148W special offer ends October 10 International Tech News: Samsung Display plans to invest 300 billion won to build an RGB OLEDoS production line, targeting the core microdisplay panel market for next-generation XR devices. The 2026 Functional Verification Study shows that the first-pass tape-out success rate for IC/ASIC projects plunged from 14.4% to 5% within two years, with only 5% of teams succeeding. Sources say Japanese photoresist suppliers plan to raise prices starting October 1, 2026, with an overall increase of about 15%, and some ArF products rising by more than 20%. Anderon, IBM’s quantum wafer foundry company, has received $1 billion in R&D funding, which will be used for 300mm (12-inch) quantum wafer manufacturing and R&D. Nexperia and Tata Electronics have reached a cooperation agreement to jointly produce and package chips in India. Tesla’s AI5 chip is in trial production at Samsung’s Texas plant and has entered the yield verification stage, with mass production verification planned to be completed by the end of this year. Domestic Tech News: Huangshan Chaoyuan Semiconductor’s "AI-empowered high-end semiconductor intelligent testing project" has started construction, with an initial phase of 350 million yuan to establish wafer and finished-product testing production lines. Guojia Gujing achieved stable mass production of 2-inch and 4-inch zero-twin gallium oxide substrates, and made a major industrialization breakthrough in 6-inch zero-twin gallium oxide. Song Shiqiang, General Manager of Slkor (www.slkoric.com), will attend the Third Core Growth Forum this afternoon. Industry chain sources say BOE will adjust prices for its display series products, effective from the fourth quarter of 2026. TCL CSOT and HKC have also successively been reported to raise prices. As of June 30, 2026, Evergrande Auto’s total liabilities reached 32.722 billion yuan, and it has exited the automobile manufacturing business. Yixing Intelligent completed nearly 2 billion yuan in financing, and its RISC-V cloud AI computing chip Epoch has been mass-produced and delivered. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: In Q2 2026, the yield of Intel’s Panther Lake processor compute chip built on the 18A process reached about 80%. The reports Intelligent World 2035: From Vision to Action and Global Digital Intelligence Index (GDII) 2026 were released. Intelligent World 2035 systematically addresses the core challenges of the Agentic AI era. Corning announced a global price adjustment of 15% or more for Japanese yen-denominated display glass substrate products. TrendForce expects global shipments of 800G optical modules to reach 50–60 million units in 2026, and 1.6T optical modules to reach 20–30 million units. Starting September 17, Kinghelm (www.kinghelm.net) and Slkor are giving benefits to employees and friends in the industry. Huili soft-seeded pomegranates and Mid-Autumn Festival mooncake gift boxes symbolize "Liu" (pomegranate) six-six smoothness and a happy reunion! It is estimated that global demand for analog chips for optical modules will exceed RMB 10 billion in 2026. Domestic Tech News: Xi'an Jiaotong University and other institutions developed textured ceramics with piezoelectric performance comparable to that of single crystals through machine learning-assisted design. Ascend 970 and Ascend 980 chips will be launched successively in 2028 and 2029. In the first half of 2026, 186 A-share semiconductor listed companies collectively achieved net profit attributable to parent companies of RMB 160.506 billion, up 607.2% year on year. D-Robotics announced the completion of a US$400 million Series C funding round. Shandong Ruifeng Polymer Materials Co., Ltd. plans to acquire no less than 51% equity in Anhui Mituo New Material Technology Co., Ltd. NI Days China will be held on October 28, 2026, at the Shanghai International Convention Center. Kinghelm Network Port Series Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor FR107 at a Big Discount—Welcome to Inquire About Pricing International Tech News: Institutions estimate that the global silicon wafer supply-demand gap will expand from about 8% at the end of 2026 to 15% in 2027 and 24% in 2028. Samsung Electro-Mechanics and Qualcomm are jointly developing organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package. TDK plans to invest 40 billion yen in two Japanese plants over the next three years to expand production equipment for thin-film inductors used to stabilize current. Japanese chemical manufacturer Resonac has successfully developed a 300 mm (12-inch) silicon carbide (SiC) single-crystal substrate. Dutch company Axelera has released its second-generation AI chip "Europa," which can be used in selected Dell and Supermicro products. Hanmi Semiconductor has signed an equipment purchase order with Elon Musk’s TerraFab project and will supply advanced packaging equipment for AI system-on-chip production. Domestic Tech News: South Korean media reported that China’s wafer fab equipment localization rate rose to 35% in 2025, up 10 percentage points from 2024, and is forecast to rise further in 2026. Chipmore Technology’s RMB 2.454 billion Suzhou advanced packaging project has been launched, focusing on heterogeneous integration packaging of optical chips and electrical chips. Slkor (www.slkoric.com) has launched a comprehensive upgrade of its three directly operated stores in Huaqiangbei, refreshing both its brand image and service experience. The G6 full-size inkjet printing equipment for printed displays independently developed by Guochuangke has been introduced into the mass production line of a leading panel manufacturer. Winbond Electronics plans to acquire 100% equity of Infineon’s NOR Flash and F-RAM businesses for US$1.12 billion. Hong Kong, China, released the First Five-Year Plan for Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will comprehensively advance the "AI+" initiative. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

On the afternoon of September 15, Song Shiqiang and Qiu Huilin of Kinghelm and Slkor attended the event International Tech News: Counterpoint data shows Samsung’s HBM share rebounded by 12 percentage points quarter-on-quarter to 33%. Apple has accepted Samsung Electronics’ memory chip quotes for Q1 2027: DRAM at nearly $2.0/Gb and NAND at nearly $0.33/Gb, up 30% to 0% compared with Q3 2026. Global 300mm wafer fab equipment spending will jump to $133 billion in 2026, setting a record high (2024: $100.6 billion). The expansion of AI computing power is being transmitted step by step from the chip side to equipment, optical interconnect, and other segments, and the strong momentum of the equipment sector has been validated by data. Executives from Kinghelm (www.kinghelm.net)/Slkor (www.slkoric.com) attended the "Lijincheng Center Enterprises Visit Tencent Penguin Island" event; Song Shiqiang and Qiu Huilin were present! Samsung’s Cheonan plant is shifting Exynos packaging capacity to HBM and scaling down its in-house mobile phone chip business. Domestic Tech News: The "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry" was released, identifying edge AI chips, EDA/IP, and advanced process nodes as key areas to tackle. The 300mm SOI wafer capacity of Xin’ao Xinyi under National Silicon Industry Group will reach about 400,000 wafers/year by the end of 2026, and silicon photonics SOI wafers will be shipped in volume in 2027. The Institute of Semiconductors, Chinese Academy of Sciences, has developed a new type of "ferroelectric tunnel junction" that uses angstrom-level tiny slips between atomic layers to achieve an ultrahigh on/off ratio, with more than 100 billion repeated switching cycles. Yunyinggu Technology Co., Ltd. has established two controlled subsidiaries, namely Shuqing Zhiyun (Shanghai) Technology Co., Ltd. and Xinqing Zhiyun (Shanghai) Technology Co., Ltd., and plans to develop two new businesses: optical interconnect and UCIe IP. Siwei Technology has completed its first round of equity financing, raising a total of nearly RMB 200 million. It is a company focused on the R&D and manufacturing of mid-to-high-end pressure chips and sensor-grade products. Xinlai Zhirong Semiconductor Technology (Shanghai) Co., Ltd. has officially launched its A-share IPO process. Kinghelm Switch Series Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Slkor 1N4148W on big sale, feel free to contact for quotation International Tech News: The combined revenue of the world's top 10 fabless IC design firms exceeded 141.45 billion US dollars in Q2 2026. NVIDIA retained the top spot, while AMD surpassed Qualcomm to rank third. Samsung Electronics is accelerating the development of silicon photonics technology and plans to complete internal testing of silicon photonic integrated circuit (PIC) wafers by the end of this year. Japan's Fujitsu unveiled its new-generation CPU FUJITSU-MONAKA, which will go on sale starting in November. ASML has reached a High-NA EUV cooperation agreement with Samsung, Intel and other partners to jointly advance supporting solutions for the new-generation high-NA extreme ultraviolet lithography machine. TrendForce analysis indicates that NOR flash memory price trends are expected to diverge in the second half of 2026, with prices of high-capacity products projected to rise by 90-110%. The Ulsan AI data center jointly developed by SK Group and Amazon has expanded its capacity to nearly 900 megawatts, with an estimated investment of 7 trillion South Korean won. Domestic Tech News: VOGT Electronics and AWA Biomedical simultaneously launched the AWA-HT series of all-glass organ-on-a-chip systems. Turing Quantum unveiled the world's first third-generation optical quantum computer, TuringQ Gen3. Song Shiqiang, General Manager of Slkor, plans to apply AI technology to the company's AI agent "Power Boy" to fully upgrade the intelligent experience of the official website (www.slkoric.com). Jia Yueting announced that Faraday Future (FF) will release 9 robot bodies on September 19, covering humanoid, quadruped and wheeled-arm forms. IDC data shows that Lenovo's x86 server shipments ranked first globally for the first time in Q2, with revenue rising by 96% year-on-year. Hua Hong Semiconductor plans to acquire a 97.4988% stake in Huali Microelectronics for 8.268 billion yuan. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

On the afternoon of September 13, elites from the Shared Procurement Alliance visited Slkor for a learning exchange International Tech News: Anthropic is reportedly planning to raise up to $100 billion through an IPO, at a valuation of about $2 trillion. In Q2 2026, global server market vendor revenue reached $166.3 billion, up 52.0% year over year and 35.7% quarter over quarter. A Chinese research team used micro-transfer printing technology to develop a high-performance thin-film lithium tantalate–silicon nitride Mach–Zehnder modulator, with relevant metrics reaching internationally advanced levels. It is predicted that by 2028, global total advanced packaging capacity is expected to grow by about 50%. On the afternoon of September 13, elites from the Shared Procurement Alliance visited Slkor (www.slkoric.com) for a learning exchange. Slkor FAE engineer Xiong Wenda gave an introduction to Slkor's company and products. The procurement elites got to know each other and shared "MOSFET Market Trends and Outlook." Slkor's best-selling product series and four models—A7, 1N4148W, FR107, and M7—were offered at limited-time special prices, receiving unanimous praise and recommendations. OpenRouter’s annual token processing volume surged from about 10 trillion to over 100 trillion within one year, with its single-day peak exceeding 1 trillion. Domestic Tech News: Recently, research teams from Tsinghua University and Shanghai Jiao Tong University completed a study in the field of practical optical computing. The related article, "How Nanophotonics Drives Optical Computing Toward Practical Applications," was published in Nature Nanotechnology. aigo (Patriot) launched the PL series iPhone storage companion: the direct-plug PL10 "Little Fruit Plate" and the magnetic PL50 "Big Fruit Plate." Shenzhen Nanfei Microelectronics Co., Ltd. moved forward with its IPO process, and Shenzhen Hai Robotics Intelligent Technology Group Co., Ltd. officially filed with the Hong Kong Stock Exchange. Seven companies including Hygon, Cambricon, Moore Threads, MetaX, Biren Technology, and Iluvatar CoreX recorded combined revenue of about RMB 21.46 billion in the first half of 2026, nearly twice that of the same period last year. According to reports, domestic computing power chips are seeing a surge in orders, with delivery schedules for some products already extended to a year out; domestic computing power demand is more than 10 times supply. Gutewei’s headquarters upgrade and expansion relocation ceremony was held in Suzhou Artificial Intelligence Industrial Park. Kinghelm FPC Connector Classification Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

1. Semiconductor Equipment Billings Hit Record $40.5 Billion as AI Capacity Buildout Accelerates Date: September 7, 2026Summary:Global semiconductor equipment billings rose 23% year over year to $40.53 billion in the second quarter of 2026, according to SEMI's Worldwide Semiconductor Equipment Market Statistics report. The figure was also up 11% from the previous quarter, marking a second consecutive record quarter for the equipment market. SEMI attributed the growth to accelerating demand for the manufacturing capacity needed to support AI chips and the global buildout of AI computing infrastructure, with expansion spread across Asia, North America and Europe.Importance:Signals that AI-driven capacity expansion is broadening across regions and equipment segments, extending the semiconductor capital spending upcycle into the second half of 2026.Source:eeNews Europe 2. Connector Reliability Named Top Specifying Criterion in Europe and North America Survey Date: September 7, 2026Summary:An independent survey commissioned by UK connector maker Harwin has mapped how engineers in Europe and North America specify and procure interconnect. Reliability was the single most important selection criterion, ahead of performance and operating life, with over 40% of respondents expecting their connectors to operate for more than ten years and a further 33% for between five and ten years. The study also found that most power connector requirements sit below 30A with a second cluster at 100A and above, and that access to downloadable models, files and footprints has become a key factor in choosing a supplier.Importance:Confirms that long-life reliability rather than price drives connector selection in industrial, telecom and automotive designs, and that digital engineering support is now part of the buying decision.Source:eeNews Europe 3. DRAM Contract Price Growth Set to Moderate to 13–18% in Q3 Date: September 7, 2026Summary:TrendForce estimates that rising DRAM contract prices lifted industry revenue 59.5% quarter on quarter to $154.73 billion in the second quarter, but now expects conventional DRAM contract price growth to moderate to 13–18% in the third quarter. The slowdown reflects a shift in demand away from high-capacity RDIMMs toward lower-capacity products, along with the limited ability of PC and smartphone customers to absorb further increases. Supplier inventories remain at historic lows, so memory supply is expected to stay tight.Importance:Marks the point where memory pricing stops being an unqualified tailwind for suppliers and starts squeezing downstream device makers, adding cost pressure across electronics bills of materials.Source:The Register 4. Samsung to Help Fortify OpenAI's Semiconductor Supply Chain Date: September 9, 2026Summary:OpenAI will develop its next-generation AI accelerators with support from Samsung Electronics, according to comments made by OpenAI Korea general manager Harrison Kim at a press conference in Seoul. The collaboration covers joint production and research on next-generation chips and spans compute and memory supply. OpenAI later clarified that the remarks referred to its existing relationship with Samsung, which includes Samsung's internal adoption of ChatGPT.Importance:Shows how AI model developers are locking in foundry, memory and packaging capacity directly with Asian suppliers, tightening the link between AI demand and semiconductor supply chains.Source:The Register 5. Infineon and SolarEdge Bring Solid-State Protection to 800 VDC AI Data Centers Date: September 10, 2026Summary:Infineon Technologies and SolarEdge Technologies have extended their collaboration into solid-state circuit breaker technology for 800 VDC power distribution in AI and hyperscale data centers. SolarEdge is leading development of the breaker while Infineon supplies its CoolSiC silicon carbide JFET technology for the protection devices. Because DC distribution has no natural current zero crossing, mechanical interruption is difficult; solid-state breakers can instead isolate faults within microseconds, sitting between a solid-state transformer and the compute rack to create a DC-native power path from the medium-voltage grid to the processors.Importance:Signals a shift in data center power architecture toward high-voltage DC, opening a new application for wide-bandgap semiconductors beyond power conversion and into protection and distribution.Source:eeNews Europe 6. Server Revenue Hits Record $166.3 Billion as AI Demand Broadens Beyond Hyperscalers Date: September 11, 2026Summary:IDC reports that server vendor revenue reached an all-time high of $166.3 billion in the second quarter, up 52% year over year, even as memory costs pushed average selling prices higher. Unit shipments rose 15.4% as AI infrastructure spending spread from hyperscalers to specialized cloud providers, sovereign AI programs and enterprises adopting inference workloads. GPU-accelerated servers accounted for nearly 53% of revenue, with average selling prices for those systems up almost 44% to $170,200.Importance:Demonstrates that AI server demand is broadening into enterprise and public-sector budgets, making the current data center buildout cycle less dependent on a handful of hyperscale buyers.Source:The Register At Kinghelm At Kinghelm, we closely monitor global trends in semiconductor process nodes, AI infrastructure growth, and advanced packaging technologies. These developments help guide our innovation in RF antennas, connectors, wire harnesses, precision cables, and interconnect solutions for next-generation electronics. About Kinghelm Shenzhen Kinghelm Electronics Co., Ltd. specializes in RF transmission, antennas, connectors, automotive wiring harnesses, precision cables, and IoT connectivity solutions. With over 17 years of experience, Kinghelm delivers rugged, reliable, and internationally compliant products for applications in new energy vehicles, industrial automation, smart terminals, and medical electronics. Disclaimer This report summarizes publicly available technology news for industry research and communication purposes only. All trademarks and content rights belong to their respective owners.

The Slkor team appeared on the streets of Huaqiangbei to give away fans International Tech News: A TrendForce report shows that in Q2 2026, the combined revenue of the world’s top ten wafer foundries reached nearly US$53.49 billion. SMIC’s revenue rose 20% quarter-on-quarter to exceed US$3 billion, with its market share rising to 5.4%, ranking third. Qualcomm and Amazon will jointly develop custom chips for next-generation large-scale AI data centers and expand high-speed optical interconnect solutions. Samsung Electronics will invest 40 billion yen to establish an AI chip packaging R&D center in Yokohama, Japan. Murata Manufacturing (Japan) expects to gradually discontinue production of some specifications in series such as GRM, GRJ, GRT, GXM, GXT, GCM, GCJ, GCG, and ZRA. ASML will break ground on a new large production campus in the Netherlands to expand mass production of extreme ultraviolet (EUV) lithography equipment. Google has hired Hailo’s former VP of R&D to head a new Israeli team dedicated to developing AI chips for robotics and autonomous driving. Domestic Tech News: Yaoxin Microelectronics released the world’s first silicon carbide superjunction MOSFET (metal-oxide-semiconductor field-effect transistor) product. Beijing E-Town released the "AI4Chip" Action Plan for the Leapfrog Development of the Integrated Circuit Industry Empowered by Artificial Intelligence (2026–2028). The Slkor (www.slkoric.com) team appeared at Huaqiangbei yesterday, wearing uniform workwear and holding a fan giveaway, attracting the attention of many merchants. Currently, Slkor is offering limited-time special prices on four models: A7, 1N4148W, FR107, and M7. New and existing customers are welcome to inquire. SmartSens launched SC365AT, the industry’s first automotive CMOS image sensor integrating SerDes and an on-chip ISP. Haiguang Xinzheng announced that the company will leverage GlobalFoundries’ silicon photonics technology to advance the deployment and mass production of 6.4T NPO products. A subsidiary of Shenzhen Kaifa Technology has spent RMB 1.85 billion to expand advanced memory chip packaging and testing capacity. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Qualcomm has proposed three pillars of 6G architecture for the AI era: connectivity, compute, and sensing. Industry insiders said that with the implementation of export controls, uncertainty in the supply of indium phosphide substrates is becoming a major risk facing the semiconductor industry. Samsung Electronics' Taylor fab has been converted into a 2nm process center and will begin trial production at the end of this month or early next month. Intel's cumulative wafer processing volume using High-NA EUV lithography has exceeded 1 million wafers. On the afternoon of September 19, 2026, the Third Chip Growth Forum will be held in the conference hall on the 5th floor of Beifang Building, Futian, Shenzhen. The forum's grand prize, an iPhone 17 Pro, is exclusively sponsored by Slkor’s third direct-sales store in Huaqiangbei (www.slkoric.com). Qualcomm and Amazon have reached an agreement to jointly build AI data center infrastructure and will collaborate on developing optical interconnect solutions of up to 1.6T. Domestic Tech News: In the first half of 2026, 5,550 A-share listed companies reported total operating revenue of RMB 37.74 trillion and net profit attributable to parent companies of RMB 3.58 trillion, up 19.4% year on year. According to the China On-Device AI Panoramic Landscape Report, the global on-device AI market was worth about RMB 200 billion in 2023 and is expected to exceed RMB 1.9 trillion (RMB 1,900 billion) by 2028, with a compound annual growth rate of 58%. Tianwei Electronics has decided to terminate the acquisition of a 60% equity interest in Chengdu Xiuwei Technology Development Co., Ltd. and the related capital increase and share expansion. Xiamen Silan Jihua's 12-inch high-end analog integrated circuit project has a total investment of RMB 20 billion, will build a 12-inch high-end analog chip production line, and aims to achieve full-line production in September 2027. CETC Ceyear’s high-end electronic measurement instrument innovation and industrial conditions construction project, with a total investment of RMB 910 million, has started construction in Qingdao. The AI-driven memory supercycle is rewriting the profit distribution rules for consumer electronics, with the speculative bubble in Huaqiangbei channels inflating and then suddenly bursting. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: Samsung Electronics' foundry business is reportedly planning to significantly increase HBM4 supply starting from the third quarter of this year. South Korea's SKC has invested KRW 281 billion in its subsidiary Absolics to fully accelerate the commercialization of semiconductor glass substrates. According to a Yole Group report, the global power gallium nitride market is expected to grow to US$3.5 billion by 2031, with a compound annual growth rate of 35% from 2025 to 2031. GlobalFoundries will receive up to US$375 million in R&D funding to accelerate quantum chip manufacturing and AI infrastructure deployment. Industry sources reveal that Intel CPUs will see their third price hike within the year, with a planned 10% increase across all products in October. Spanish silicon photonics company iPronics has completed a US$125 million Series B financing round, co-led by Maverick Silicon and Light Street Capital, with participation from NVIDIA. Domestic Tech News: Qiushui Semiconductor has released the world's first mass-producible 8-inch red-light Micro-LED chip. The 2026 IFA Berlin (International Consumer Electronics Show) will feature approximately 1,900 exhibitors, with Chinese companies accounting for nearly half (928). From September 10 to October 10, 2026, Slkor (www.slkormicro.com) will offer limited-time promotional pricing on four models – A7, 1N4148W, FR107, and M7 – at highly competitive prices. Customers in Huaqiangbei may contact Slkor's three directly-operated stores. On September 8, memory module manufacturer Longsys was listed on the main board of the Hong Kong Stock Exchange, reporting revenue of RMB 24.088 billion for the first half of 2026. RoboSense has completed mass production and delivery of its self-developed Peacock SPAD-SoC, an ultra-large-array system-level chip designed for robotics and vehicle blind-spot perception applications. MediaTek is reportedly set to launch the Dimensity 9600 Pro chip at its new product event on September 15. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. The Xuanjie O3 makes its global debut, premiering on the Xiaomi 18 Fold. 2. According to reports, SK Hynix and Samsung Electronics have less than ten days of memory inventory, and the memory market could face an "unprecedented shortage" in 2027. 3. Google is accelerating the development and rollout of its custom-designed chips. 4. The Novo Nordisk Foundation is building a new quantum chip factory in Copenhagen. 5. Kinghelm (www.kinghelm.com.cn) presents Song Shiqiang's discourse series: *"Huaqiangbei Shanzhai Phones" Research (Part III)* and its English edition *"Huaqiangbei Shanzhai Phones" Research (Part III)*, launching globally alongside the bilingual versions of Parts I and II. This forms a comprehensive all-media globalization campaign to boost the Kinghelm and SLKOR brands and make them stand out. 6. According to forecasts, rising prices of NAND flash and DRAM could push the selling price of the iPhone Pro series up by more than US$200 compared to last year. Domestic Tech News: 1. Recently, Wuhan Xinrongguang Technology Co., Ltd. was established with a registered capital of 13.2 billion yuan, jointly held by Wuhan Xinxin, Optics Valley Semiconductor Industry Investment, and others. 2. Since 2024 to date, Xiaomi Automobile's cumulative deliveries have exceeded 800,000 vehicles. 3. In the first seven months of 2026, China's total integrated circuit exports reached US$216 billion, a year-on-year increase of 99.5%. 4. Recently, Xiyuan Zhisuan (Shanghai) Technology Co., Ltd. was established, wholly owned by Zhiyuan Innovation (Shanghai) Technology Co., Ltd. 5. Xinlian Jicheng's revenue in the first half of 2026 reached 4.562 billion yuan, up 30.53% year-on-year; net profit attributable to shareholders was 278 million yuan, a year-on-year increase of 263.40%.6. Black Sesame Technologies and AUBO Intelligence have made key progress in their collaborative efforts in the field of embodied intelligent robots. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: According to the Global Semiconductor Equipment Market Report, semiconductor equipment shipments rose 23% year-on-year to reach USD 40.53 billion. According to recent DigiTimes reports, Micron Technology is exploring a high-durability NAND flash module and researching methods to place NAND flash closer to GPUs. Samsung Electronics has partnered with Arm to officially launch R&D for edge-side AI chips. OpenAI released its new flagship model GPT-6 Astra, branding it as "a new generation of intelligence". Storage costs in Q3 2026 may surge fourfold year-on-year. The market expects the iPhone 18 Pro series to see a 10%-20% price increase. Reports state that Google is salvaging DDR4 memory modules from decommissioned servers for reuse in new-generation AI servers. Domestic Tech News: Statistics show that Guangdong’s core artificial-intelligence industry has exceeded RMB 300 billion so far, with a year-on-year growth rate of over 40%. DeepSeek has finalized plans for a gigawatt-scale data center in Ulanqab, Inner Mongolia, and intends to deploy 160,000 Ascend 950DT chips. The Sichuan-Chongqing Basketball Tournament has carried on for 21 years. The 2026 Hongtai Yuxing Cup Shenzhen Sichuan-Chongqing Basketball Tournament opened on September 5. Slkor (www.slkormicro.com) and Kinghelm were among the sponsors, and General Manager Song Shiqiang attended the opening ceremony. Zhending Group is investing more than RMB 12 billion to build an advanced packaging substrate base project in Shenzhen. Naura Technology has achieved major technical breakthroughs in the next-generation 3D DRAM manufacturing process for memory chips, developing an innovative two-step cyclic etching process. Guangdong Leadyo IC Testing Co., Ltd. has terminated the acquisition of 100% equity in Guoxinwei. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: According to institutional estimates, the global electronic specialty gases market is projected to reach approximately US$13.3 billion in 2026, with a compound annual growth rate of about 8.5% from 2025 to 2030. Data shows that global annual shipments of smartphones stand at approximately 1.2–1.3 billion units, PCs at about 260–280 million units, and automobiles at around 90 million vehicles. Combined with billions of IoT and wearable devices, these form a massive potential installed base for end-side AI chips. Gartner projects that global AI PC shipments will reach 143 million units in 2026, accounting for 55% of total PC shipments. Global PCB leader Zhen Ding Group has invested over RMB 12 billion to double down on the AI sector, with its subsidiary, Li Ding Semiconductor, launching its advanced packaging substrate base in Shenzhen's Bao'an District. Song Shiqiang's discourse on "Research on 'Huaqiangbei Shanzhai Mobile Phones' (Part III)" has gained significant traction in both international and domestic media. It has been republished and included by hundreds of media outlets, including Non-network, International Electronic Business, China Tech Hot News, China Hengyang News Network, Shenzhen Observation Net, Macro Trends Finance, Times Quick Tech, Morning News, People's Commentary Net, Hong Kong Economic News Network, New Guang Network, Enterprise Daily, and Oriental Financial Report. Mr. Song Shiqiang concluded: "The full-media publicity matrix of 'Research on 'Huaqiangbei Shanzhai Mobile Phones' (Parts I, II, and III)' is continuously gaining momentum, helping to drive the internationalization of Kinghelm (www.kinghelm.net) and Slkor (www.slkoric.com)!" It is forecast that VCSEL, which possesses a complete GaAs emission and reception ecosystem, and the silicon photonics route centered on indium phosphide (InP), will together form the two major mainstream technology systems for AI optical interconnects in the future. Domestic Tech News: Kinghelm (www.kinghelm.com.cn) has launched the "Kinghelm" switch series, including detection switches, limit switches, encoding switches, tactile push buttons, Type-C female sockets, Type-C interfaces, joystick switches, five-key switches, rotary wheel switches, SMD detection switches, vertical detection switches, plug-in detection switches, SMD encoding switches, and other products. Lonyu Semiconductor plans to establish a large-scale 12-inch high-end semiconductor silicon wafer production facility, with an intended total investment of RMB 3 billion. The Xixi Electronics semiconductor advanced packaging and testing project, with a total investment of RMB 5.018 billion, has officially been signed and settled in Donggang Town, Xishan District, Wuxi City. The Fubei Microelectronics RF filter chip R&D and production base project, with a total investment of RMB 3.99 billion, has landed in Changzhou's Tianning District. NAURA has achieved a major technological breakthrough in the manufacturing process of next-generation memory chips—3D DRAM—by developing an innovative two-step cyclic etching process. Biren Technology achieved operating revenue of RMB 1.236 billion in the first half of 2026, representing a year-on-year increase of approximately 1,997.6% (nearly 20-fold). Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. SK Group's Chey Tae-won stated that SK Hynix is considering joint production of memory chips with Japan's Kioxia. 2. Samsung Display will invest a total of 67 trillion KRW in stages in Asan, South Korea, to build production lines for OLED and next-generation displays. 3. South Korea's semiconductor exports reached $46.65 billion in August, surging 209% year-on-year. 4. Pollen Robotics, a subsidiary of Hugging Face, launched the micro bipedal robot Microduck, which surpassed $4 million in sales in just four days. 5. A Counterpoint report shows that driven by memory price hikes, over 40% of smartphones will see price increases in 2026, with average prices up 15% and new models 25% more expensive year-on-year. 6. Broadcom reported Q3 2026 revenue of $29.59 billion, up 86% from $15.95 billion in the same period last year, of which AI semiconductor revenue reached $16.7 billion, up 221% year-on-year. Domestic Tech News: 1. Google, OPPO, and vivo plan to adopt dual-layer Ultra-Thin Glass (UTG) structures in their next-generation foldable smartphones. 2. Hua Hong Grace invested an additional $2.1 billion in Hua Hong Wuxi Phase III to build a 12-inch specialty process wafer foundry line. 3. Kinghelm Electronics (www.kinghelm.com.cn) fully participated in the 17th National Radio Management Publicity Month, with this year's theme: "Rule of Law Escorts the New Journey of the '15th Five-Year Plan', Jointly Forging a Strong Electromagnetic Space Safety Net!" 4. Xiaomi Auto will enter the European market in 2027, with its first stop in Germany, and has signed cooperation memoranda with eight German dealerships. 5. Horizon Robotics' Journey autonomous driving chips have surpassed 15 million in cumulative shipments, with the Journey 6M already mass-produced and deployed in over 1 million vehicles. 6. JCET plans to raise 6.5 billion RMB through a private placement for capacity expansion and upgrades in advanced packaging projects. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. Chip giant Qualcomm will raise chip prices starting September 1, with increases in the double-digit percentage range.2. China's Baidu is now a dual-primary-listed company on both the Hong Kong Stock Exchange and the Nasdaq Global Select Market.3. From September 8 to 11, Goldman Sachs will host the Communacopia + Technology Conference in San Francisco, with 32 global companies from fields including digital/AI chips, EDA software, analog semiconductors, semiconductor equipment, memory, and IT services participating.4. South Korea has further tightened export controls, adding high-performance AI integrated circuits, advanced semiconductor manufacturing equipment, nucleic acid synthesis equipment, and other categories to its strategic materials control list.5. On September 2, Kinghelm (www.kinghelm.com.cn) and Slkor's "Daily Chip News" article *"The '15th Five-Year Plan' Industry Blueprint: China to Accelerate Development of Six Emerging Pillar Industries Including Integrated Circuits and Intelligent Robots (Kinghelm September 1 Chip News)"* was featured as the recommended headline in the Industry News section of WeCom (Enterprise WeChat). WeCom now covers more than 50 industries including retail, education, finance, healthcare, government affairs, manufacturing, and the Internet, and has become the preferred tool for most enterprises in private-domain operations and customer management, with a very high industry recommendation rate.6. ZTE's Nubia NaviX Ultra – the world's first AI agent smartphone – will feature Doubao mobile assistant, is positioned as a mass-production flagship, and is scheduled to launch and go on sale in September. Domestic Tech News: 1. According to statistics, total investment in China's semiconductor industry in the first half of 2026 reached RMB 800.2 billion, a year-on-year increase of 72.4%.2. UniVISTA's domestically developed next-generation full-featured high-performance digital simulator, UniVista Simulator Plus (UVS+), won the Gold Reputation Product Award for EDA at the 3rd 'China Chip' Awards.3. BYD Semiconductor's next-generation satellite-architecture 4D millimeter-wave radar chip has entered mass production.4. From September 9 to 11, the 2026 International Integrated Circuit Innovation Expo (IICIE) will be held at the Shenzhen World Exhibition & Convention Center (Bao'an).5. The *Shenzhen Special Economic Zone SME Development Promotion Regulations* were passed, focusing on the full chain of entrepreneurship, innovation, market expansion, financing, and rights protection for small and medium-sized enterprises, and introducing a series of hard-hitting innovative measures.6. Chinese memory chip maker Longsys plans to list in Hong Kong, raising no more than HK$6.28 billion (approximately RMB 5.395 billion). Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

Dajiayuan Successfully Hosted an Electronics Industry Summit International Tech News: Silicon-Valley-based a16z has raised USD 1.1 billion for its "Machine Age" fund, which will focus on investments in AI processors, memory chips, data storage and other sectors. Sumitomo Chemical of Japan has established a mass-production system for 4-inch indium phosphide epitaxial wafers at its Ibaraki plant and officially launched product sales. Sources indicate that Panasonic Industrial Solutions will raise prices for its full-range substrate materials effective September 1st, with increases ranging from 15% to 30%. Kioxia will invest 1 trillion yen to build its third factory in Kitakami, Japan, mainly for manufacturing its high-density 3D NAND Flash chips. NVIDIA's H200 chip re-enters the Chinese market, contributing less than 1% to its total data-center revenue of USD 89 billion. Samsung Electronics will deploy 1,612 major new Korean-manufactured production equipment units at its semiconductor back-end processing factory under construction in Thái Nguyên Province, Vietnam. Domestic Tech News: Advanced thin-film equipment from Advanced Micro-Fab (AMF) has surpassed 500 cumulative reactor shipments, covering core models such as low-pressure chemical vapor deposition and metal thin-film deposition. BYD's new-generation 4D millimeter-wave radar chip with satellite-supported architecture has entered mass-production phase. On August 30, 2026, Dajiayuan Procurement Network successfully held an electronics-industry summit themed "A Decade of Co-Core, Intelligent Chain for Fertile Land". Representatives from Kinghelm / Slkor Semiconductor attended the event. Another price-hike wave hits electronic fabrics. Jushi China has officially lifted September prices for electronic fabrics, with heavy-weight fabrics up 15% and thin-weight fabrics rising by 20%. Hygon Information's invention patent ZL202011542637.5 Method for Loading and Running Virtual Trusted Environment, Data Processing and Security Processing Device has won China Patent Gold Award. SHRINK Semitech has released 3.3× mask-based silicon 2.5D packaging technology, solving industry challenges for large-size chip integration. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: It is estimated that Google TPU will reach an inflection point for large-scale volume production in 2028, with overall shipments expected to reach 12 to 15 million units. Leading semiconductor silicon wafer manufacturer Liumingwei plans to establish a large-scale 12-inch high-end semiconductor silicon wafer production capacity project, with a total intended investment of RMB 3 billion. The groundbreaking ceremony for SK Hynix's advanced packaging production base for AI-oriented memory was held. NVIDIA and MediaTek have deepened their long-term partnership and will jointly build an AI computing platform spanning from the edge to the cloud. Kinghelm Electronics (www.kinghelm.com.cn) has further expanded its product range, covering RF connectors, filter diplexers, RF jumper cables, 4G/5G antennas, Wi-Fi/Bluetooth antennas, BeiDou/GPS antennas, pin headers and female headers, terminal blocks and connectors, board-end sockets and pogo pins, non-standard/specialty, industrial/medical/automotive connectors, mechanical switches, electronic switches, encoders, board-mounted connectors, FPC/FFC connectors, data signal connectors, optical communication accessories, Type-C connectors, audio/video connectors, and more. For inquiries, please contact Ms. Yang: +86 15013493365. Apple CEO Tim Cook will transition to Executive Chairman, and Apple's hardware engineering head, John Ternus, will succeed him as CEO. Domestic Tech News: During the "15th Five-Year Plan" period, China will focus on optimizing its industrial structure and accelerating the development of six major emerging pillar industries: integrated circuits, aerospace, biomedicine, low-altitude economy, new energy storage, and intelligent robotics. The groundbreaking ceremony for the global headquarters project of Lianxun Instruments, with a total investment of RMB 2 billion, was held. The R&D and manufacturing base project for semiconductor thin-film and etching equipment of Shangji Semiconductor, with a total investment exceeding RMB 1 billion, has been established. Changxin Technology achieved operating revenue of RMB 150.31 billion in the first half of 2026, a year-on-year surge of 873.64%; net profit attributable to shareholders of the listed company reached RMB 77.605 billion. TCL CSOT will gradually establish optical communication chip manufacturing capabilities in phases. The phase II chip packaging project of Meiqing Semiconductor commenced, and the high-end semiconductor materials project of Guanghuan Semiconductor was launched. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: South Korea will build a new semiconductor industrial park in the southwestern Honam region, with a combined investment of 1,500 trillion won across three major projects: semiconductors, AI data centers, and physical AI. Amazon has sharply raised prices on its hardware devices, with some products increasing by as much as 60%, including Fire TV streaming devices and Kindle e-readers. Renesas Electronics has established a Physical AI and Robotics Laboratory in Beijing to drive next-generation robotics innovation from proof-of-concept to large-scale deployment. Samsung Electronics and SK Hynix continue to expand chip production capacity at their NAND flash memory wafer fabrication bases in China, helping to regulate market supply and demand. Industry sources indicate that the traditional packaging capacity gap may exceed 20% by 2027, with insufficient supply of wire bonders becoming the main bottleneck for capacity expansion. Samsung Advanced Institute of Technology (SAIT) has pioneered a technology that uses trace amounts of carbon to control the size and orientation of crystal grains. Domestic Tech News: Wuhan Xinxin has launched the "Xin Guang Plan" (Chip Light Plan), aiming to build the "3D Link-Optoelectronic Integration-SOI" first pole of the industry and attract and cultivate more than 10,000 high-end semiconductor professionals. BYD achieved operating revenue of 344.82 billion yuan in the first half of 2026, and also announced that its 10,000th flash charging station has been officially completed in Shenzhen, now covering 332 cities. Slkor (www.slkoric.com) has completed its strategic transformation from a Fabless to an IDM model, focusing on power devices and power management ICs, and is collaborating with its sister company Kinghelm to build a full-industry ecosystem, providing high-quality products and services to the global market. In the first seven months of 2026, China’s cumulative export value of integrated circuits reached 1.49 trillion yuan, a year-on-year increase of 91.6%. Zhixin Sensing has launched a public-version MEMS micromirror large-array chip; industry experts believe this will strongly promote the domestic substitution process of optical circuit switching (OCS). Jingyao Shengsi has achieved stable mass production of 2-inch aluminum nitride single crystals through independent R&D, with quality reaching internationally advanced levels. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: In Q1 2026, the combined revenue of the world's top five enterprise-grade SSD brands reached US$18.46 billion, up 86.1% quarter-on-quarter. SEMCO will raise prices for its consumer-grade X5R products by 25% to 30% on average for OEM and ODM customers, in order to curb order intentions and free up production capacity for expanding high-end production lines. China's SmartSens has launched an ultra-high-definition mobile CMOS image sensor—the SCC85XS—delivering comprehensive performance advantages including ultra-low noise, low power consumption, high sensitivity, and high color reproduction. NVIDIA has agreed to acquire AI platform Hugging Face for US$12.9 billion. Kinghelm Electronics (www.kinghelm.net) and Slkor Semiconductor invite you to the 3rd Chip Growth Forum on September 19—see you there! This forum is sponsored by Slkor Huaqiangbei Flagship Store No. 3. Welcome to register and join the lucky draw for a mobile phone! Elon Musk stated that the importance of the AI5 chip has driven him to invest a great deal of working time, and he has even memorized the design of the AI5 chip. Domestic Tech News: Wang Sheng, Vice Governor of Guangdong Province, praised the extreme efficiency of the Huaqiangbei smart hardware industry chain in Shenzhen: design in the morning, prototyping in the afternoon, mass production the next day, and global shipping within a week! The "15th Five-Year Plan for the Development of Strategic Emerging Industries in Shanghai" has been released, specifying that Shanghai will focus on developing high-end chips, AI-enabled design, advanced packaging, new devices, and new architecture chips. Shanghai Xun Nuo Brain Technology Co., Ltd. has been registered and established, with joint shareholding from Shanghai-listed company Oriental Semiconductor and others. Powertech Technology plans to start mass production of panel-level advanced packaging as early as early 2027, targeting applications such as server CPUs, AI computing chips, and advanced optics. SMIC reported operating revenue of approximately RMB 38.635 billion for the first half of 2026, a year-on-year increase of 19.4%; net profit reached approximately RMB 4.467 billion, up 94.2% year-on-year. Changjing Technology's automotive-grade power device and module intelligent manufacturing project has landed in Jiangyin, Wuxi. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.

International Tech News: 1. OpenAI has published benchmark results for its self-developed inference chip, codenamed "Jalapeño," showing superior energy efficiency compared to NVIDIA's GB300 chip. 2. A research team at Kyoto University has developed a novel silicon carbide junction field-effect transistor (SiC JFET) that operates stably at temperatures up to 600°C. 3. Infineon has acquired India-based C2i Semiconductor to expand its presence in AI data center power management. 4. Kioxia of Japan will invest USD 6.27 billion to build a new memory chip production plant. 5. Intel and AMD CPU shipments have declined for two consecutive quarters, with the latest quarter showing a year-on-year drop of over 20%. 6. South Korean media report that the export price of DRAM produced in Korea has surged 12-fold in three years, with the current per-kilogram export price equivalent to 620 grams of gold. Domestic Tech News: 1. Xiaomi's self-developed flagship processor, the "Xuanjie O3," has become the first chip to support Changxin LPDDR6 memory. 2. An IDC report shows that China's AI foundational data service market reached RMB 6.262 billion in 2025 and is projected to grow to RMB 7.834 billion in 2026. 3. Slkor (www.slkoric.com) has accelerated its international expansion, with its total online followers exceeding 100,000. A popular science video on "Full-Bridge Rectification" posted on its TikTok account garnered 710,000 views, significantly enhancing Slkor's brand exposure and professional image in the global market. 4. Huaqin Technology reported revenue of RMB 93.719 billion for the first half of 2026, with net profit attributable to shareholders of approximately RMB 3.0 billion, up 58.8% year-on-year. 5. Yunyi Electric has terminated its semiconductor discrete device R&D and industrialization project originally planned for 2022. 6. Lion Microelectronics plans to invest RMB 3.0 billion to build a project with a monthly production capacity of 200,000 12-inch lightly doped substrate wafers and 120,000 12-inch silicon epitaxial wafers. Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.