Slkor Summer Team Building at Laohugou: Integrity Forges Far Vision, Chips Drive the Future

International Tech News:

1. Changxin Memory Technologies (CXMT) currently ranks fourth in the global DRAM market, trailing Micron Technology, SK Hynix, and Samsung.
2. NVIDIA's GB300 AI chip has been officially unveiled.
3. According to Yole, the advanced packaging market reached $55 billion in 2025 and is projected to exceed $120 billion by 2031.
4. IDC forecasts that global AI server shipments may surpass 2 million units in 2026, representing a year-on-year increase of up to 55%.
5. On July 25, Slkor (www.slkoric.com) held its "Integrity Sustains Ambition, Chips Power the Future" summer team-building event in Laohugou. Activities including tug-of-war, off-road ATV rides, and an outdoor barbecue feast enabled all participants to enjoy themselves while strengthening team cohesion and solidarity.
6. China's Innoscience has launched an all-GaN 12kW 800V-to-50V HVDC power supply solution for data centers.

Domestic Tech News:

1. The 2026 Fortune China 500 list has been released, with 25 semiconductor and electronic component companies including SMIC, NAURA Technology, and Tongfu Microelectronics making the ranking.
2. Xiaomi has raised its 2026 smartphone shipment target from approximately 90 million units to 110 million units.
3. Nasen Intelligent Technology (Zhejiang) Co., Ltd. has passed the IPO hearing on the Hong Kong Stock Exchange (HKEX).
4. Mass-production servers equipped with the LX500 — a RISC-V + AI intelligent-convergence chip developed by Lanxin Computing — have officially rolled off the production line at Lenovo's LCFC factory in Hefei.
5. Unigroup Guoxin Microelectronics plans to establish its power semiconductor business as one of its core operating segments and key industrial pillars.
6. Qiyuan Xinchuang, a wholly-owned subsidiary of Shangwei New Materials, has officially signed an agreement to settle in the Zhangjiang Robotics Valley in Pudong, Shanghai, as a key municipal artificial intelligence project.

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