ASE Launches Panel-Level Packaging Automation, Targets Mass Production in H1 Next Year

International Tech News:

1.ASE Technology Holding announced the industry’s first 310mm panel-level packaging automated production line, with mass production expected in the first half of 2027.

2.Intel plans to upgrade its Rio Rancho fab, aiming to turn it into the world’s first glass substrate mass production base.

3.On May 27, Micron Technology saw its market capitalization increase by more than $140 billion in a single day, pushing its total valuation above $1 trillion.

4.STMicroelectronics plans to enter the quantum chip foundry business using its 300mm fully depleted silicon-on-insulator (FD-SOI) process technology.

5.Reports indicate that Qualcomm has reached an AI ASIC chip cooperation agreement with ByteDance, with ByteDance set to purchase millions of custom chips.

6.Samsung plans to invest $1.5 billion to build a memory chip testing facility in Vietnam, expected to begin operations in November 2027.

Domestic Tech News:

1.Alibaba DAMO Academy’s Xuantie 9 series high-performance processor has completed adaptation for the Android operating system.

2.Shanghai Silicon Industry Group increased its registered capital from approximately RMB 27.5 billion to about RMB 33.1 billion, an increase of around 20%.

3.SLKOR (www.slkormicro.com)corporate promotional video is about to begin production, showcasing its overall strength and innovation—stay tuned.

4.According to China’s flash memory market data, DDR4 RAM module prices saw an expanded week-on-week decline, with 8GB and 16GB modules dropping by 12.5% and 8.82% respectively.

5.Jingfang Technology has made an additional capital injection of $30 million to accelerate the construction of its production base in Malaysia.

6.Tencent’s in-house “Canghai” chip won the hardware video encoding competition at Moscow State University.

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