Samsung Electro-Mechanics and Qualcomm Collaborate on 2.1D Advanced Packaging

Slkor FR107 at a Big Discount—Welcome to Inquire About Pricing

International Tech News:

1. Institutions estimate that the global silicon wafer supply-demand gap will expand from about 8% at the end of 2026 to 15% in 2027 and 24% in 2028.

2. Samsung Electro-Mechanics and Qualcomm are jointly developing organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package.

3. TDK plans to invest 40 billion yen in two Japanese plants over the next three years to expand production equipment for thin-film inductors used to stabilize current.

4. Japanese chemical manufacturer Resonac has successfully developed a 300 mm (12-inch) silicon carbide (SiC) single-crystal substrate.

5. Dutch company Axelera has released its second-generation AI chip “Europa,” which can be used in selected Dell and Supermicro products.

6. Hanmi Semiconductor has signed an equipment purchase order with Elon Musk’s TerraFab project and will supply advanced packaging equipment for AI system-on-chip production.
   
   

Domestic Tech News:

1. South Korean media reported that China’s wafer fab equipment localization rate rose to 35% in 2025, up 10 percentage points from 2024, and is forecast to rise further in 2026.

2. Chipmore Technology’s RMB 2.454 billion Suzhou advanced packaging project has been launched, focusing on heterogeneous integration packaging of optical chips and electrical chips.

3. Slkor (www.slkoric.com) has launched a comprehensive upgrade of its three directly operated stores in Huaqiangbei, refreshing both its brand image and service experience.

4. The G6 full-size inkjet printing equipment for printed displays independently developed by Guochuangke has been introduced into the mass production line of a leading panel manufacturer.

5. Winbond Electronics plans to acquire 100% equity of Infineon’s NOR Flash and F-RAM businesses for US$1.12 billion.

6. Hong Kong, China, released the First Five-Year Plan for Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will comprehensively advance the “AI+” initiative.
   
   

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