Kinghelm to Launch Satellite Communication and Optical Communication Products

International Tech News:

1. Chinese AI company DeepSeek has begun preparations for an initial public offering (IPO).
2. Intel has decided to adopt ASML's next-generation High-NA EUV lithography systems for the production of certain flagship Panther Lake laptop processors.
3. Researchers from the Korea Institute of Industrial Technology and Pohang University of Science and Technology have developed a new process that enables the stable stacking of more than ten ultra-thin semiconductor chips.
4. Samsung Electronics has completed the tape-out of Tesla's next-generation AI chip, AI5.
5. Mr. Qin Xianghong, Chief Engineer of Kinghelm (www.kinghelm.net), has revealed that Kinghelm is about to launch products for satellite communications and optical communications. This initiative, which has been in preparation for several years with accumulated talent and technology reserves, is in line with Kinghelm's nearly two decades of deep expertise in microwave RF technology and products such as Beidou antenna signal connectors.
6. The global satellite direct-to-device (D2D) market is rapidly transitioning from the "technology validation" and "business model exploration" phases into the deep-water zone of "large-scale commercial competition" and "diverging technology roadmaps."

Domestic Tech News:

1. In the first half of 2026, the integrated circuit output of China's industrial enterprises above designated size reached 279.8 billion units, equivalent to an average daily production of over 1.5 billion integrated circuits.
2. Yunbao Intelligence has submitted its GEM IPO materials to the Shenzhen Stock Exchange, positioning itself as the "first domestic DPU stock."
3. FaceMagic Intelligence secured over RMB 5 billion in cumulative financing in the first half of 2026, with a valuation exceeding RMB 20 billion.
4. BYD Semiconductor's self-developed automotive-grade BMS AFE (battery management analog front-end) chips have achieved cumulative shipments exceeding 100 million units.
5. Shanghai Zhenglong Xinchuang Microelectronics Co., Ltd. plans to invest RMB 7.5 billion in the "HITS Advanced Packaging R&D and Industrialization Project."
6. Black Sesame Intelligence has completed the acquisition of Zhuhai YiZhi Electronics.

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