2026 Shenzhen Sichuan-Chongqing Basketball Tournament Set to Tip Off

International Tech News:

1. A South Korean research team has successfully developed a novel two-dimensional semiconductor structure, enabling unimpeded current flow.

2. Japan plans to purchase 27,500 units of NVIDIA's next-generation Rubin chips to build its self-developed foundational artificial intelligence model for robotics.

3. The European Union has approved Germany's provision of 659 million euros in state subsidies to fund four European "first-of-their-kind" semiconductor factories in Germany.

4. Nokia and NVIDIA have jointly launched the first commercial AI-driven Radio Access Network (RAN) platform, with NVIDIA simultaneously acquiring a stake in Nokia.

5. SK Hynix has commenced mass production and shipments of its 12-layer HBM4, with the product now entering the capacity ramping-up phase.

6. Due to global aging populations and declining birth rates, TrendForce predicts that the humanoid companion robot market will reach $1.1 billion by 2030.

Domestic Tech News:

1. In the first half of this year, the integrated circuit output of industrial enterprises above a designated size in China reached 279.8 billion units, averaging over 1.5 billion units produced per day.

2. It is reported that ByteDance, in collaboration with ZTE Nubia, will launch multiple models of its first AI agent smartphone (the "Doubao AI Agent Smartphone") this year.

3. The 2026 Shenzhen Sichuan-Chongqing Basketball Tournament is about to begin. Song Shiqiang of Kinghelm Electronics and Slkor (www.slkormicro.com) wishes the 2026 Shenzhen Sichuan-Chongqing Basketball League a complete success!

4. MeiKeShenSi, Biren Technology, and JieYue have joined forces to build a photoelectric-integrated AI computing infrastructure.

5. The 2026 Bay Area Semiconductor Industry Ecosystem Expo (referred to as the "Wanxin Expo") will be held from October 14 to 16 at the Shenzhen Convention and Exhibition Center (Futian).

6. XinYueNeng and XinJuNeng have successfully completed an equity financing round of over 700 million yuan.

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