The 3rd Chip Growth Forum 2026 Successfully Concludes

“Dare to Be Extraordinary, March Toward Championship” — The 3rd Chip Growth Forum 2026 Successfully Concludes

International Tech News:

1. According to estimates by industry institutions, the commercial space market has exceeded RMB 2.8 trillion, and satellite internet is accelerating the opening of a hundred-billion-level industrial blue ocean.

2. The 2026 World Manufacturing Convention, themed “Intelligent Manufacturing for a Better World,” will kick off on September 20–23 at the Hefei Binhu International Convention and Exhibition Center.

3. China Mobile and Qualcomm Technologies, Inc. successfully completed the world’s first interoperability test between a 6G prototype base station and terminal prototype in the U6G band compliant with the latest 3GPP definitions, marking a new stage of systematic verification for key 6G technologies.

4. It is forecast that in 2026, global monthly demand for 12-inch silicon wafers will be about 10 million wafers, with a supply-demand gap of about 1.5 million wafers per month; the shortage of high-end lightly doped wafers and epitaxial wafers is expected to continue until 2028.

5. “Dare to Be Extraordinary, March Toward Championship” — The 3rd Chip Growth Forum 2026 successfully concluded. The forum was originally initiated by CGC Xinxirang Consulting. The third directly operated store of Slkor Semiconductor (www.slkoric.com) in Huaqiangbei was the main sponsor; Song Shiqiang and Chen Na presented new Apple phones to the grand prize winners!

6. Tower Semiconductor and NewPhotonics® have begun volume shipments of integrated laser and serviceable optical engine products.
   
   

Domestic Tech News:

1. On the afternoon of September 19, Kinghelm (www.kinghelm.net) and Slkor held a team-building training activity. The Slkor Warriors basketball team and the Kinghelm badminton team welcomed new members!

2. The 5th GMIF Innovation Summit, co-hosted by the Shenzhen Memory Industry Association and others, will open on September 23 at the Renaissance Shenzhen Bay Hotel.

3. ChangXin Memory Technologies announced mass production of its fifth-generation DRAM technology platform (G5 platform).

4. Recently, Zhejiang Jingneng Microelectronics Co., Ltd. completed a Series C financing round of RMB 630 million.

5. The 2026 China Semiconductor Packaging and Testing Technology and Market Annual Conference will be held from November 4 to 6 at the Fengda International Hotel in Nanjing.

6. On September 19, the advanced IC substrate digital-intelligent manufacturing base at the second campus of Liding Semiconductor Technology (Shenzhen) Co., Ltd. was officially inaugurated in Bao'an District.
   
   

Disclaimer: The information presented above was compiled from publically available web sources and does not necessarily reflect our company's beliefs or positions. If you believe any of the content infringes on your rights or you have any issues, please contact us and we will respond swiftly.