Tongxin Association Youth Basketball Team Wins Runner-Up at the “Hongxing Yutai Cup” 2026 Sichuan-Chongqing Basketball League

International Tech News:

1. TrendForce estimates that in 2026, the average 8-inch capacity utilization rate of the world’s top ten wafer foundries will rise to 88%, and may reach 90% in the second half of the year.
2. Qualcomm (QCOM-US) and Apple (AAPL-US) have renewed their global patent licensing agreement. The new agreement will take effect on April 1, 2027.
3. Tower Semiconductor, the world’s leading silicon photonics chip foundry, will build its largest optical communications semiconductor production center in Japan.
4. Infineon’s semiconductor plant in Thailand will officially commence production on October 1.
5. Kinghelm (www.kinghelm.net) brand products are selling well, including tactile switches, detector switches, slide switches, push-button switches, micro switches, multi-function switches, illuminated switches, DIP switches, toggle switches, sensing switches, limit switches, encoder switches, joystick switches, five-key switches, thumbwheel switches, SMD detector switches, vertical detector switches, through-hole detector switches, SMD encoder switches, etc., as well as Kinghelm models such as KH-IPEX-K501-29, KH-6X6X5H-STM, KH-6X6X5H-Z2J, KH-6X6X6H-STM, KH-VH-PT3.96, KH-SMA-P-8029, KH-3216-H0209, and others.
6. According to statistics, in Q2 2026, global data center Ethernet switch market revenue reached USD 12.3 billion, a year-on-year increase of 64.5%.

Domestic Tech News:

1. The Tongxin Association Youth Basketball Team won runner-up in the “Hongxing Yutai Cup” 2026 Sichuan-Chongqing Basketball League. Kinghelm and Slkor (www.slkoric.com) were major co-organizers of this competition.
2. Kinwong Electronic is expected to officially list on the Main Board of the Hong Kong Stock Exchange on September 29.
3. Chixin Semiconductor completed over RMB 200 million in Series A+ financing.
4. The OPPO Find X10 Pro Max will be among the first to feature MediaTek’s Dimensity 9600 Pro flagship platform.
5. The Phase II, Stage 2 project of Huatian Nanjing Advanced Packaging and Testing Base has topped out, with a total investment of RMB 3 billion. It is expected to be put into use in Q1 2027.
6. Xinlian Integration has completed the cumulative paid-in registered capital of RMB 2.129 billion for Xinlian Advanced.

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