International Tech News:

1. According to an institutional forecast, the global advanced packaging market is expected to grow eightfold by 2033, reaching USD 80.5 billion.

2. Amazon plans to invest over USD 200 billion by 2026 to accelerate its artificial intelligence and infrastructure deployment, with a focus on data centers, AI chips, and networking equipment.

3. Global smartphone and PC shipments in 2025 are expected to increase year-on-year by 5.2% and 7.8%, respectively.

4. Omdia research shows that the global smartphone market performed better than expected in Q1 2026, with a year-on-year growth of 1%.

5. On April 11, the sessions “Legal Risk Prevention for Directors, Supervisors, and Senior executives” (delivered by lawyer Chen Yulin) and “Leadership” (delivered by General Manager Song Shiqiang) were held in sequence. All employees of Kinghelm (www.kinghelm.com.cn) and Slkor participated, enhancing thinking and guiding practice through knowledge.

6. Japan’s NAND flash manufacturer Kioxia is negotiating a three-year long-term supply agreement (LTA) with a major cloud service and virtual server provider, with the contract expected to run through 2029.

Domestic Tech News:

1. The research group led by Professor Hu Yizhe from the School of Integrated Circuits, University of Science and Technology of China (USTC), has achieved significant progress in high-speed VCO-based ADC chip research.

2. Vision AI chip leader SigmaStar Technology (Stock Code: 301536) has resubmitted its listing application to the Hong Kong Stock Exchange, accelerating its dual “A + H” listing strategy.

3. Jita Semiconductor has signed a project cooperation agreement with global power semiconductor leader Infineon Technologies.

4. “Shenzhen Yinwang Intelligent Technology Co., Ltd.” has changed its name to “Yinwang Intelligent Technology Co., Ltd.”

5. Domestic research teams have made major breakthroughs in wafer-scale growth and controllable doping of new high-performance two-dimensional semiconductor materials.

6. Domestic core technologies such as phased array chips, GaN RF, and interference suppression have reached commercial-level maturity for low Earth orbit satellite applications.

 

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